Cu₅Cr₃₅Fe₃₅V₂₀Ti₅, Cu₁₀Cr₃₅Fe₃₅V₁₀Ti₁₀, Cu₁₅Cr₃₅Fe₃₅V₅Ti₁₀ and Cu₂₀Cr₃₀Fe₃₀V₁₀Ti₁₀ were produced by low-pressure arc-melting to evaluate the feasibility of developing reduced activation high entropy alloys containing copper. The materials present a dendritic microstructure and some Cu and Ti segregation in the as-cast condition, being the Cu₅Cr₃₅Fe₃₅V₂₀Ti₅ the most homogenous alloy. Copper particles, with a mean size of about 10 nm, are found distributed inside the dendrites. The volume fraction of the copper particles is ~ 7 times higher in the alloy with 5 at.% Cu content that in the alloy with 20 at.%, with values ranging from 22 ± 5 to 3 ± 2 particles/μm². Combination of massive Berkovich nanoindentation, statistical analysis and analytical scanning electron microscopy, has been successful for determining the hardness and elastic modulus values of each phase and quantifying their contribution to microhardness values obtained by standard Vickers microindentation.

Cu ₅ Cr ₃₅ Fe ₃₅ V ₂₀ Ti ₅ , Cu ₁₀ Cr ₃₅ Fe ₃₅ V ₁₀ Ti ₁₀ , Cu ₁₅ Cr ₃₅ Fe ₃₅ V ₅ Ti ₁₀和Cu ₂₀ Cr ₃₀ Fe ₃₀ V ₁₀ Ti ₁₀由低压电弧熔化生产，以评估开发含铜的低活化高熵合金的可行性。这些材料在铸态条件下呈现出树枝状微观结构和一些 Cu 和 Ti 偏析，Cu ₅ Cr ₃₅ Fe ₃₅ V ₂₀ Ti ₅是最均匀的合金。发现平均尺寸约为 10 nm 的铜颗粒分布在枝晶内部。含铜量为 5 at.% 的合金中铜颗粒的体积分数是含铜量为 20 at.% 的合金中的约 7 倍，其值范围为 22 ± 5 至 3 ± 2 个颗粒/μm ². 大量 Berkovich 纳米压痕、统计分析和分析扫描电子显微镜相结合，已成功确定每个相的硬度和弹性模量值，并量化它们对标准维氏显微压痕获得的显微硬度值的贡献。