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Design of compact LC lowpass filters based on coaxial through-silicon vias array
Microelectronics Journal ( IF 2.2 ) Pub Date : 2021-08-25 , DOI: 10.1016/j.mejo.2021.105217
Xiangkun Yin 1 , Fengjuan Wang 2 , Vasilis F. Pavlidis 3 , Xiaoxian Liu 1 , Qijun Lu 1 , Tao Zhang 1 , Yang Liu 1
Affiliation  

By utilizing coaxial through-silicon via (TSV) technology, compact LC low-pass filters (LPFs) are proposed. Firstly, several capacitors based on coaxial TSV are investigated, in detail, by means of analytic calculation, finite element method (FEM) simulation, and measurement. Secondly, a formula for the inductance of coaxial TSV-based spiral inductors is proposed and verified by FEM simulations and measurements. Finally, based on the investigation of TSV-based capacitors and inductors, an analytical model of the proposed LC LPFs based on 2 ×4,2×5,2× 6, and 2 × 7 coaxial TSV arrays is proposed, and the equivalent circuit model and the finite element method (FEM) model are established in ADS and HFSS, respectively. The LPFs are fabricated and verified through measurements. In the proposed LPFs, coaxial TSVs are used as capacitors and inductors simultaneously, which leads to a more compact size. The parasitic capacitance of the inductors can, helpfully, induce a notch point for the proposed LPFs in stopband and improve the roll-off rate.



中文翻译:

基于同轴硅通孔阵列的紧凑型LC低通滤波器设计

通过利用同轴硅通孔 (TSV) 技术,紧凑 C提出了低通滤波器 (LPF)。首先,通过解析计算、有限元法(FEM)仿真和测量,对几种基于同轴TSV的电容器进行了详细研究。其次,提出了一个基于同轴TSV的螺旋电感器的电感公式,并通过有限元仿真和测量进行了验证。最后,基于对基于 TSV 的电容器和电感器的研究,提出的分析模型C LPF 基于 2 ×4,2×5,2× 提出了6、2×7同轴TSV阵列,分别在ADS和HFSS中建立了等效电路模型和有限元法(FEM)模型。LPF 是通过测量制造和验证的。在提议的 LPF 中,同轴 TSV 同时用作电容器和电感器,从而使尺寸更紧凑。电感器的寄生电容有助于在阻带中为提议的 LPF 引入陷波点并提高滚降率。

更新日期:2021-09-01
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