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Fabrication and characterization of W/Cu/Ni-based high specific gravity alloy with Zr and Ti combined addition
International Journal of Refractory Metals & Hard Materials ( IF 3.6 ) Pub Date : 2021-08-20 , DOI: 10.1016/j.ijrmhm.2021.105674
Dong-Guang Liu 1, 2 , Peng Zhang 1 , Chong-Fei Ruan 1 , Lin Meng 1 , Lai-Ma Luo 3, 4, 5 , Zu-Min Wang 6 , Yu-Cheng Wu 3, 4
Affiliation  

W/Cu/Ni-based high specific gravity alloys with Zr and Ti combined addition were successfully prepared through mechanical ball milling combined with spark plasma sintering. The morphologies, structural evolutions, and compositions of the W/Cu/Ni-based composites were thoroughly studied through scanning electron microscopy, energy dispersive spectrometry, and high-resolution transmission electron microscopy. Results reveal that the prepared (Zr, Ti)-doped W/Cu/Ni-based composite has completely compact structure and uniform element distribution after sintering, resulting in the W/Cu/Ni-based alloys with superior microhardness (up to 911.9). The Ti and Ni elements combined to form TixNiy intermetallic compounds, and the CuxZry intermetallic compounds were formed by the combination of Cu and Zr elements. The electrical properties of the W/Cu/Ni-based composites were also explored in detail. The electrical conductivity of the W/Cu/Ni composite increased from 13.2 MS/m to 19.9 MS/m, and the mass loss of electric ablation decreased from 6.20 mg to 1.21 mg through Zr and Ti combined addition. Hence, the W/Cu/Ni-based alloys with Zr and Ti combined addition provide an effective support for future electrical contact materials in electrical and electronic fields.



中文翻译:

Zr、Ti复合添加W/Cu/Ni基高比重合金的制备与表征

采用机械球磨结合放电等离子烧结方法成功制备了Zr、Ti复合添加的W/Cu/Ni基高比重合金。通过扫描电子显微镜、能谱仪和高分辨率透射电子显微镜对 W/Cu/Ni 基复合材料的形貌、结构演变和成分进行了深入研究。结果表明,制备的(Zr、Ti)掺杂W/Cu/Ni基复合材料在烧结后具有完全致密的结构和均匀的元素分布,使W/Cu/Ni基合金具有优异的显微硬度(高达911.9) . Ti 和 Ni 元素结合形成 Ti x Ni y金属间化合物,Cu x Zr yCu和Zr元素结合形成金属间化合物。还详细研究了 W/Cu/Ni 基复合材料的电性能。W/Cu/Ni复合材料的电导率从13.2 MS/m提高到19.9 MS/m,通过Zr和Ti的联合添加,电烧蚀的质量损失从6.20 mg降低到1.21 mg。因此,W/Cu/Ni 基合金与 Zr 和 Ti 的组合添加为未来电气和电子领域的电接触材料提供了有效的支持。

更新日期:2021-08-29
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