Polymers with enhanced thermal conductivity are in great demand for thermal management of electronic devices. However, the thermal conductivity of polymers is typically low (∼0.2 W/(m K)). In this work, four epoxy resins were cured using one commercial diepoxide and four diamine hardeners with an anthraquinone structure. The thermal conductivity of one epoxy resin reached 0.52 W/(m K), which is ∼2.5 times that of common polymers. These epoxy resins are shown to have a semicrystalline structure, and both the thermal conductivity and density of the four epoxy resins exhibited a positive correlation with crystallinity.

中文翻译：

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含蒽醌类固化剂的高导热半结晶环氧树脂

具有增强导热性的聚合物对于电子设备的热管理有很大的需求。然而，聚合物的热导率通常较低（~0.2 W/(m K)）。在这项工作中，使用一种商用双环氧化物和四种具有蒽醌结构的二胺固化剂固化了四种环氧树脂。一种环氧树脂的热导率达到 0.52 W/(m K)，是普通聚合物的 2.5 倍。这些环氧树脂具有半结晶结构，四种环氧树脂的热导率和密度均与结晶度呈正相关。