The panel-level redistribution-layer (RDL)-first fan-out packaging for hybrid substrate is studied. Emphasis is placed on the process, materials, design, and fabrication of: 1) heterogeneous integration of one large chip and one small chip with 50- $\mu \text{m}$ pitch (minimum); 2) fine metal linewidth and spacing RDL-first substrate on a temporary panel carrier; 3) ordinary build-up package substrate on a panel; 4) hybrid substrate which is by soldering the RDL-first substrate on the build-up substrate; and 5) chips to hybrid substrate bonding and underfilling. Reliability assessment by thermomechanical simulation includes thermal cycling of the heterogeneous integration of the two-chip package on the hybrid substrate that is performed by a nonlinear temperature- and time-dependent finite-element analysis.

中文翻译：

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扇出型 RDL-First 面板级封装的混合基板

研究了混合基板的面板级再分布层（RDL）优先扇出封装。重点放在以下工艺、材料、设计和制造上：1) 一个大芯片和一个小芯片的异构集成，具有 50- $\mu \text{m}$ 间距（最小）；2) 临时面板载体上的精细金属线宽和间距 RDL-first 基板；3) 面板上的普通积层封装基板；4) 混合基板，将 RDL-first 基板焊接在增层基板上；和 5) 芯片到混合基板键合和底部填充。通过热机械仿真进行的可靠性评估包括混合基板上两芯片封装的异质集成的热循环，该热循环由非线性温度和时间相关的有限元分析执行。