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The thermal and mechanical properties of thermosetting composites prepared for welding by the improved TP hybrid interlayer
Journal of Adhesion Science and Technology ( IF 2.3 ) Pub Date : 2021-08-17 , DOI: 10.1080/01694243.2021.1964171
Guiyang Li 1 , Liang Yin 1 , Daosheng Wang 1, 2 , Xuhai Xiong 2 , Pu Zhao 2 , Chaoyuan Tan 1
Affiliation  

Abstract

The approach for joining carbon fiber reinforced epoxy (CF/Epoxy) composites proposed in this study is based on the use of a plasticizing chip (PC), one side with rich resin and the other side with bare fiber, prepared by 1, 2, 3 or 4 pieces of glass fiber reinforced polyetherimide (GF/PEI) prepregs and a piece of glass fiber cloth (GFC), added as a last ply in the stacking sequence of CF/Epoxy composites. During curing, the epoxy partially penetrates in the side with a bare fiber of PC, leading to micro-mechanical interlocking as the main connection mechanism between the PC and the CF/Epoxy composites. To verify the effects of PC on the thermal and mechanical properties of CF/Epoxy composites, TGA, DMA, DCB, bending, interlaminar shear and drop-weight tests were carried out. The results showed that PC can effectively alleviate the impact of thermal degradation without weakening the properties of CF/Epoxy composites.



中文翻译:

改进的TP杂化夹层制备的用于焊接的热固性复合材料的热力学和力学性能

摘要

本研究中提出的连接碳纤维增强环氧树脂 (CF/Epoxy) 复合材料的方法是基于使用塑化芯片 (PC),一侧有丰富的树脂,另一侧有裸纤维,由 1、2、 3 或 4 块玻璃纤维增​​强聚醚酰亚胺 (GF/PEI) 预浸料和一块玻璃纤维布 (GFC),作为 CF/环氧树脂复合材料堆叠顺序的最后一层添加。在固化过程中,环氧树脂部分渗入PC裸纤维的侧面,导致微机械互锁成为PC与CF/Epoxy复合材料之间的主要连接机制。为了验证 PC 对 CF/Epoxy 复合材料的热性能和机械性能的影响,进行了 TGA、DMA、DCB、弯曲、层间剪切和落锤试验。

更新日期:2021-08-17
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