This article presents a variation-aware exponential matrix–rational approximation (EM-RA) model for the signal integrity analysis in single-walled carbon nanotube (SWCNT) bundle and hybrid copper-CNT (Cu-CNT) on-chip interconnects. The variations include temperature (300–500 K) only, and temperature (300–500 K) and dielectric surface roughness (10–180 pm) both. The transient analysis is carried out for the signal integrity parameters, crosstalk and propagation delay, estimation using the proposed EM-RA model. The results obtained using the proposed model are compared with the industry-level simulation program with an integrated circuit emphasis (SPICE) simulator. The comparison shows excellent agreement for the results with less than 1% error. The proposed model is also compared for the computational time complexity. It is observed that a speed-up factor of 74.24 and 48.35 is attained using the proposed temperature-parameterized model during the analysis of coupled-two and coupled-three interconnect lines, respectively. The speed-up further increases to 485.41 and 378.35 for coupled-two and coupled-three lines, respectively, when the temperature and dielectric surface roughness parametrized EM-RA model is used. This computational CPU time expense efficiency and the accuracy of the proposed model in comparison to the HSPICE simulator ensures immense possibility regarding its implementation in computer-aided design (CAD) tools for carrying out the transient analysis of SWCNT bundle and Cu-CNT interconnect lines. Encouraging results for the eye-diagram analysis reports 95.54% and 99.37% of the eye height and eye width for the SWCNT network, and 99.77% and 99.96% of the eye height and eye width for the Cu-CNT.

中文翻译：

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SWCNT束和混合Cu-CNT互连的指数矩阵-有理近似（EM-RA）模型

本文提出了一种变化感知指数矩阵-有理近似 (EM-RA) 模型，用于单壁碳纳米管 (SWCNT) 束和混合铜-CNT (Cu-CNT) 片上互连中的信号完整性分析。变化仅包括温度 (300–500 K)，以及温度 (300–500 K) 和电介质表面粗糙度 (10–180 pm)。对信号完整性参数、串扰和传播延迟进行瞬态分析，并使用建议的 EM-RA 模型进行估计。使用所提出的模型获得的结果与具有集成电路重点 (SPICE) 模拟器的工业级仿真程序进行了比较。比较显示结果非常一致，误差小于 1%。还比较了所提出的模型的计算时间复杂度。据观察，在分析耦合两个和耦合三个互连线期间，使用所提出的温度参数化模型分别获得了 74.24 和 48.35 的加速因子。当使用温度和电介质表面粗糙度参数化 EM-RA 模型时，对于耦合二线和耦合三线，加速分别进一步增加到 485.41 和 378.35。与 HSPICE 模拟器相比，这种计算 CPU 时间成本效率和所提出模型的准确性确保了其在计算机辅助设计 (CAD) 工具中实现 SWCNT 束和 Cu-CNT 互连线的瞬态分析的巨大可能性。眼图分析的令人鼓舞的结果报告了 SWCNT 网络眼高和眼宽的 95.54% 和 99.37%，以及 99.77% 和 99。