ABSTRACT

In recent years, the specificity of the demand for selective, adaptable and inexpensive methods has always been one of the key factors in support of further research on electroless copper plating. In essence, this is a rather complex process involving several pretreatment steps. The electrolytes used are potentially unstable due to the spontaneous onset of nucleation as a result of local changes in pH or ongoing reactions between the products and the metal ions, which form insoluble salts. The aim of the present investigation has been to study the possibilities for obtaining thin copper coatings from an environmentally friendly electrolyte for electroless copper plating, which does not contain a toxic reducing agent. A comparison was made between copper layers on acrylonitrile-butadiene-styrene (ABS) polymer obtained by two different deposition techniques: the first used an environmentally friendly electrolyte for chemical copper plating without reducer, and the second – a trilonic copper electrolyte containing formaldehyde as a reducer. The following methods were used to study the morphology, structure and elemental composition of the obtained layers: scanning electron microscopy (SEM), X-ray diffraction (XRD), atomic force microscopy (AFM) and energy dispersion X-ray analysis (EDS).

摘要

近年来，对选择性、适应性和廉价方法需求的特殊性一直是支持化学镀铜进一步研究的关键因素之一。本质上，这是一个相当复杂的过程，涉及多个预处理步骤。由于 pH 值的局部变化或产物与金属离子之间的持续反应导致成核的自发开始，所使用的电解质可能不稳定，从而形成不溶性盐。本研究的目的是研究从环境友好的电解液中获得薄铜涂层的可能性，用于化学镀铜，不含有毒还原剂。对通过两种不同沉积技术获得的丙烯腈-丁二烯-苯乙烯 (ABS) 聚合物上的铜层进行了比较：第一种是使用环保电解液进行化学镀铜，不含还原剂，第二种是含有甲醛的三氯铜电解液。减速器。使用以下方法研究所得层的形貌、结构和元素组成：扫描电子显微镜（SEM）、X射线衍射（XRD）、原子力显微镜（AFM）和能量色散X射线分析（EDS） .