Insoluble gas in water can remarkably affect the boiling heat transfer performance, which is of great practical importance for many applications. The effect of insoluble nitrogen gas on the boiling of water over copper surfaces with different temperature conditions is investigated through molecular dynamics simulations. Observations on the nanofilm boiling phenomena and insights into the fundamental mechanism are analyzed in terms of the temporal and spatial evolutions of temperature and the instantaneous heat flux curves. Results show that the nanofilm boiling processes change from normal evaporation to explosive boiling by increasing surface temperature owing to the conduction dominating the heat transfer mode. The nitrogen molecules are adsorbed on the copper substrate. This condition makes the explosive boiling of water containing nitrogen to occur easily due to its low substrate temperature and short onset time. Compared with the water boiling on nitrogen adsorption substrate, the boiling of pure water on bare substrate benefits the heat transfer in large superheat range because it has higher heat flux and the normal evaporation still works on a surface with relatively high temperature. This work may benefit the fundamental understanding and practices of boiling heat transfer in many industrial applications.

水中的不溶性气体会显着影响沸腾传热性能，这对许多应用具有重要的实际意义。通过分子动力学模拟研究了不溶性氮气对不同温度条件下铜表面上水沸腾的影响。根据温度和瞬时热通量曲线的时间和空间演变，分析了对纳米膜沸腾现象的观察和对基本机制的洞察。结果表明，由于传导主导传热模式，纳米膜沸腾过程通过增加表面温度从正常蒸发转变为爆炸沸腾。氮分子吸附在铜基板上。这种情况使得含氮水由于其底物温度低、起效时间短，容易发生爆炸性沸腾。与氮吸附基底上的水沸腾相比，纯水在裸基底上沸腾有利于大过热范围内的传热，因为它具有更高的热通量，并且正常蒸发仍然在较高温度的表面上进行。这项工作可能有益于许多工业应用中沸腾传热的基本理解和实践。纯水在裸基板上沸腾有利于大过热范围内的传热，因为它具有更高的热通量，并且正常蒸发仍然在温度相对较高的表面上进行。这项工作可能有益于许多工业应用中沸腾传热的基本理解和实践。纯水在裸基板上沸腾有利于大过热范围内的传热，因为它具有更高的热通量，并且正常蒸发仍然在温度相对较高的表面上进行。这项工作可能有益于许多工业应用中沸腾传热的基本理解和实践。