Abstract

Scanning electron microscopy has been used to study recrystallization processes during the annealing (to 16 h) of nickel with cellular, mixed, and submicrocrystalline structures formed by high-pressure torsion deformation. Annealing in a temperature range of 200–350°C failed to produce a recrystallized structure with an average grain size of smaller than 1 μm. The smallest recrystallized grain size was found in the submicrocrystalline (SMC) nickel structure after annealing at 300°С. The SMC structure was formed via deformation to e = 9. The kinetics of normal grain growth was not implemented during the annealing of SMC nickel. The nonmonotonic size dependences of recrystallized grain on the temperature and annealing time in the SMC nickel are analyzed.

中文翻译：

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高压扭转变形镍加热晶粒长大动力学

摘要

扫描电子显微镜已被用于研究镍在退火（至 16 小时）过程中的再结晶过程，其中镍具有通过高压扭转变形形成的蜂窝状、混合状和亚微晶结构。在 200-350°C 的温度范围内退火未能产生平均晶粒尺寸小于 1 μm 的再结晶结构。在 300°С 退火后，在亚微晶 (SMC) 镍结构中发现了最小的再结晶晶粒尺寸。SMC 结构是通过变形到e = 9形成的。在 SMC 镍的退火过程中没有实现正常晶粒生长的动力学。分析了 SMC 镍中再结晶晶粒对温度和退火时间的非单调尺寸依赖性。