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Effect of powder processing and alloying additions (Al/ZrB2) on the microstructure, mechanical and electrical properties of Cu
Advanced Powder Technology ( IF 5.2 ) Pub Date : 2021-07-31 , DOI: 10.1016/j.apt.2021.07.012
Mahammad Ali Shaik 1 , Brahma Raju Golla 1 , Shivkumar Khaple 2
Affiliation  

The present work elucidates the effect of powder processing conditions (milling/mixing) and conductive alloying element (Al: aluminium) and ceramic (ZrB2: zirconium diboride) reinforcement addition on the densification, microstructure and electrical conductivity of copper (Cu) processed via hot pressing route. Disregard of alloying element/reinforcement/content or powders preparation method, the density of Cu materials varied between 92.16 and 99.76% ρth (theoretical density) after hot pressing at a low temperature of 500 °C. In case of Cu-Al alloys, the powder processing method significantly influenced its microstructure and conductivity. Particularly the Cu-Al alloys processed using mixed powders consisted of various phases Cu, α-Cu, γ1 (Cu9Al4), δ (Cu3Al2), ζ1 (Cu4Al3), η2 (CuAl) and θ (CuAl2) and the Cu alloys prepared using milled powders composed of either only α-Cu or α-Cu and γ1 (Cu9Al4) phases (depending on the Al content). Whereas, only Cu and ZrB2 phases were observed with the Cu-ZrB2 composites processed using either milled or mixed powers. In case of Cu-Al alloys, the hardness (0.88–3.41 GPa) and strength (540.30–1120.18 MPa) of Cu increased with the addition of Al. Interestingly, the hardness (0.88–2.55 GPa) and strength (508.50–970.60 MPa) of Cu increased upto 5 wt% ZrB2 and then they lowered with further addition of ZrB2. In particular, the hardness and strength of Cu-ZrB2 composites are lower than Cu-Al alloys reflecting the effectiveness of solid solution strengthening in the Cu alloys as compared to dispersion strengthening mechanism in Cu composite. The pure Cu prepared using milled powders exhibited low conductivity (75.70% IACS) than Cu processed using as-received/un-milled powders (97.00% IACS). Also, the Cu-ZrB2 composites measured with better electrical conductivity than Cu-Al alloys. Depending on the milling conditions and alloying/reinforcement amount, the conductivity of Cu-ZrB2 composites varied between 44.10 and 88.70% IACS.



中文翻译:

粉末加工和合金添加(Al/ZrB2)对 Cu 的显微组织、机械和电性能的影响

目前的工作阐明了粉末加工条件(研磨/混合)和导电合金元素(Al:铝)和陶瓷(ZrB 2:二硼化锆)增强剂添加对通过以下方式加工的铜(Cu)的致密化、微观结构和电导率的影响热压路线。不考虑合金元素/增强剂/含量或粉末制备方法,在500°C 的低温下热压后,Cu 材料的密度在 92.16 至 99.76% ρ th(理论密度)之间变化。对于 Cu-Al 合金,粉末加工方法对其微观结构和导电性有显着影响。特别是使用混合粉末加工的 Cu-Al 合金由不同相 Cu, α-Cu, γ 1 (Cu 9Al 4 )、δ (Cu 3 Al 2 )、ζ 1 (Cu 4 Al 3 )、η 2 (CuAl) 和 θ (CuAl 2 ) 以及使用仅由 α-Cu 或 α- 组成的研磨粉末制备的 Cu 合金Cu 和 γ 1 (Cu 9 Al 4 ) 相(取决于 Al 含量)。而使用 Cu-ZrB 2仅观察到Cu 和 ZrB 2使用研磨或混合粉末加工的复合材料。在 Cu-Al 合金的情况下,Cu 的硬度 (0.88-3.41 GPa) 和强度 (540.30-1120.18 MPa) 随着 Al 的加入而增加。有趣的是,Cu 的硬度 (0.88–2.55 GPa) 和强度 (508.50–970.60 MPa) 增加至 5 wt% ZrB 2,然后随着进一步添加 ZrB 2降低。特别是,Cu-ZrB 2复合材料的硬度和强度低于Cu-Al合金,反映了与Cu复合材料中的弥散强化机制相比,Cu合金中固溶强化的有效性。使用研磨粉末制备的纯铜比使用原样/未研磨粉末加工的铜 (97.00% IACS) 表现出低电导率 (75.70% IACS)。此外,Cu-ZrB 2测量的复合材料具有比 Cu-Al 合金更好的导电性。根据研磨条件和合金化/增强量,Cu-ZrB 2复合材料的电导率在 44.10 和 88.70% IACS 之间变化。

更新日期:2021-08-27
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