In this study, the stress analysis for an orthotropic thin film bonded to an orthotropic elastic substrate is addressed using both the analytical and finite element methods. The analytical method employs the integrodifferential formulation with the aid of membrane assumption. Utilizing the finite element method, the effect of orientation of the material principal directions are studied. The loading scenarios include a temperature gradient imposed on the film and a far-field uniaxial tension on the substrate. The results of current study indicate that the ratio of the film to the substrate stiffness plays a leading role in the film stress distribution. For the mechanical loading applied to the substrate, a soft thin film attached to a relatively stiffer substrate is preferred. The film can tolerate the induced thermal stresses as it is bonded to a softer host structure. The rotation angle of material orthotropy directions significantly affects the stress singularity near the film edges up to a certain extent.

在这项研究中，结合到正交各向异性弹性基底的正交各向异性薄膜的应力分析将使用解析和有限元方法进行处理。分析方法在膜假设的帮助下采用积分微分公式。利用有限元方法，研究了材料主方向取向的影响。加载场景包括施加在薄膜上的温度梯度和基板上的远场单轴张力。目前的研究结果表明，薄膜与基材刚度的比率在薄膜应力分布中起主导作用。对于施加到基材上的机械载荷，优选附着在相对较硬的基材上的软薄膜。由于薄膜与较软的主体结构结合，因此它可以承受感应的热应力。材料正交各向异性方向的旋转角度在一定程度上显着影响薄膜边缘附近的应力奇异性。