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Effect of temperature on the SU-8 photoresist filling behavior during thermal nanoimprinting
Polymer Engineering and Science ( IF 3.2 ) Pub Date : 2021-07-26 , DOI: 10.1002/pen.25751
Lei Sun 1 , Helin Zou 2, 3 , Shengbo Sang 1
Affiliation  

SU-8 photoresist is an ideal thermal-imprinting polymer, which has been widely used in micro-nano devices in recent years. However, the research on the filling behavior of SU-8 photoresist during thermal nanoimprinting is not complete. In this paper, the stress relaxation curves and shear stress/rate flow curves were measured to analyze the temperature dependent rheological properties of SU-8 photoresist. The filling behavior of SU-8 photoresist was discussed based on thermal imprinting results at various temperatures. High-precision nanochannels were fabricated with replication error of 2.8% at optimized thermal imprinting temperature of 85°C and duration of 10 min, which paves the way for high-precision fabrication of SU-8-based micro-nanofluidic chips.

中文翻译:

温度对热纳米压印过程中SU-8光刻胶填充行为的影响

SU-8光刻胶是一种理想的热压印聚合物,近年来在微纳器件中得到了广泛的应用。然而,对SU-8光刻胶在热纳米压印过程中的填充行为的研究并不完整。在本文中,通过测量应力松弛曲线和剪切应力/速率流动曲线来分析 SU-8 光刻胶的温度相关流变特性。基于不同温度下的热压印结果讨论了 SU-8 光刻胶的填充行为。在优化的热压印温度 85°C 和持续时间 10 分钟下,制造出复制误差为 2.8% 的高精度纳米通道,为基于 SU-8 的微纳流控芯片的高精度制造铺平了道路。
更新日期:2021-08-05
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