Nowadays, the thermal management of electronic components, devices and systems is one of the most important challenges of this technological field. The ever-increasing miniaturization also entails the pressing need for the dissipation of higher power energy under the form of heat per unit of surface area by the cooling systems. The current work briefly describes the use on those cooling systems of the novel heat transfer fluids named nanofluids. Although not intensively applied in our daily use of electronic devices and appliances, the nanofluids have merited an in-depth research and investigative focus, with several recently published papers on the subject. The development of this cooling approach should give a sustained foothold to go on to further studies and developments on continuous miniaturization, together with more energy-efficient cooling systems and devices. Indeed, the superior thermophysical properties of the nanofluids, which are highlighted in this review, make those innovative fluids very promising for the aforementioned purpose. Moreover, the present work intends to contribute to the knowledge of the nanofluids and its most prominent results from the typical nanoparticles/base fluid mixtures used and combined in technical and functional solutions, based on fluid-surface interfacial flows.

中文翻译：

---

用于下一代电子热管理的纳米流体：综述

如今，电子元件、设备和系统的热管理是该技术领域最重要的挑战之一。不断增加的小型化也带来了通过冷却系统以每单位表面积的热量的形式耗散更高功率能量的迫切需要。目前的工作简要描述了称为纳米流体的新型传热流体在这些冷却系统上的使用。尽管在我们日常使用的电子设备和电器中并未广泛应用，但纳米流体值得深入研究和调查，最近发表了几篇关于该主题的论文。这种冷却方法的发展应该为继续小型化的进一步研究和发展提供持续的立足点，以及更节能的冷却系统和设备。事实上，本综述强调的纳米流体优越的热物理特性使这些创新流体非常有希望用于上述目的。此外，目前的工作旨在促进纳米流体的知识及其最突出的结果，这些结果来自基于流体 - 表面界面流动的技术和功能解决方案中使用和组合的典型纳米粒子/基础流体混合物。