This paper proposed to prepare micro through-slit array on thin metallic plate with masked jet electrochemical machining. An ECM mathematic model was developed with ANSYS Parametric Design Language to analyze the evolution process of micro through-slit, including the broken through process of workpiece. In each step, machining status was monitored to judge whether the workpiece was broken through, then both model and boundary condition were reset accordingly, thus the broken through process was well solved. The simulation results indicated that with moving speed of workpiece decreasing (increasing machining time in ECM model), the sectional profile evolved from groove to a tapering micro through-slit, and a micro through-slit with low taper was formed at last. The changes of electric field distribution in both X and Z direction affected the material dissolution along the side wall of micro through-slit and contributed to the formation of micro through-slit. The experiments were performed with different moving speeds of workpiece, and the sectional profile evolution process agreed well with that in simulation. Moreover, with the same real machining time, low pulse duty cycle was useful to enhance the transport of electrolytic product in the small machining area and reduce the dimensional difference of micro through-slit. At last, ten micro through-slits with the length of 30 mm were well prepared at one time on a thin metallic plate of 50 μm. The width of upper surface and lower surface was 206.1 ± 2.28 μm and 193.7 ± 1.97 μm, respectively, and the taper was about 7.1°.

本文提出用掩膜喷射电化学加工在薄金属板上制备微通缝阵列。利用ANSYS参数化设计语言建立了ECM数学模型，分析了微贯通缝的演化过程，包括工件的贯通过程。在每一步都监测加工状态，判断工件是否被击穿，然后相应地重新设置模型和边界条件，从而很好地解决了击穿过程。仿真结果表明，随着工件移动速度的降低（ECM模型中加工时间的增加），截面轮廓从凹槽演变为逐渐变细的微通槽，最终形成低锥度的微通槽。X 中电场分布的变化和ž方向的影响沿贯通狭缝微的侧壁的材料溶解，并有助于通过狭缝形成微的。实验在不同工件移动速度下进行，截面轮廓演化过程与仿真结果吻合较好。此外，在实际加工时间相同的情况下，低脉冲占空比有利于在小加工区域内增强电解产品的输送，减少微通槽的尺寸差异。最后，在50μm的薄金属板上一次准备好10个长度为30mm的微通槽。上表面和下表面的宽度分别为206.1±2.28μm和193.7±1.97μm，锥度约为7.1°。