当前位置: X-MOL 学术IEEE Trans. Compon. Packag. Manuf. Technol. › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
Reliability Study of Polymers Used in Sub-4-μm Pitch RDL Applications
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.2 ) Pub Date : 2021-05-12 , DOI: 10.1109/tcpmt.2021.3079515
Emmanuel Chery , Fabrice F. C. Duval , Michele Stucchi , John Slabbekoorn , Kristof Croes , Eric Beyne

Reliability results obtained on a photosensitive polymer-based redistribution layer (RDL) process with two-metal layers and a target pitch below $4~\mu \text{m}$ are presented. Fully processed samples have been subjected to 1000 h of high-temperature storage (HTS) performed at 150 °C when a second set of samples endured a temperature–humidity (TH) stress executed at 85 °C and 85 % RH. A thermal cycling (TC) stress between $- 50\,\,^{\circ }\text{C}$ and 125 °C for 1000 cycles was also performed on a third sample set. After 1000 h spent at 150 °C, an increase in the metal line resistivity resulting from copper oxidation by atmospheric oxygen diffusing through the polymer is observed. The oxidation of the top part of the metal lines is further confirmed by failure analyses performed on the stressed samples. Eight different polymers used as a potential capping solution to block the diffusion of oxygen toward the metal lines are investigated. The most promising approach for a reliable polymer-based RDL process involves the use of a mold layer.

中文翻译:

亚 4 微米间距 RDL 应用中使用的聚合物的可靠性研究

基于光敏聚合物的再分布层 (RDL) 工艺获得的可靠性结果,该工艺具有两个金属层,目标间距低于 $4~\mu \text{m}$ 被提出。当第二组样品承受在 85°C 和 85% RH 下执行的温湿度 (TH) 应力时,完全加工的样品已经在 150°C 下进行了 1000 小时的高温储存 (HTS)。之间的热循环 (TC) 应力 $- 50\,\,^{\circ }\text{C}$ 在 125 °C 下进行 1000 次循环,也对第三组样品进行了测试。在 150 °C 下花费 1000 小时后,观察到由于大​​气氧扩散通过聚合物导致铜氧化导致金属线电阻率增加。通过对受压样品进行的失效分析进一步证实了金属线顶部的氧化。研究了用作潜在封端溶液以阻止氧气向金属线扩散的八种不同聚合物。可靠的基于聚合物的 RDL 工艺最有前途的方法涉及使用模具层。
更新日期:2021-05-12
down
wechat
bug