ABSTRACT

The aim of the study was to define the influence of microstructural properties on the electrochemical properties of copper in four different forms: copper in sheet form, copper doped with phosphorus, electroplated copper and copper wire. Open circuit potential and polarization resistance measurements were carried out in order to determine the electrochemical properties and corrosion rates of copper in 0.1 M NaCl solution in oxic conditions at ambient temperature. Statistical evaluation of the electrochemical data was performed in order to differentiate between the various forms of copper samples. Microstructural and electrochemical investigations were combined with electron microscopy and Raman analysis of the corrosion products after immersion of the copper samples in a 0.1 M NaCl solution for 30 days. The various morphologies of copper corrosion products were identified and analyzed by Raman spectroscopy for the various forms of copper.

摘要

该研究的目的是确定微观结构特性对四种不同形式铜的电化学性能的影响：片状铜、掺磷铜、电镀铜和铜线。进行开路电位和极化电阻测量是为了确定铜在环境温度和含氧条件下在 0.1 M NaCl 溶液中的电化学性质和腐蚀速率。进行电化学数据的统计评估以区分各种形式的铜样品。将铜样品浸入 0.1 M NaCl 溶液 30 天后，将微观结构和电化学研究与电子显微镜和拉曼分析相结合，对腐蚀产物进行分析。