The sintered nano-silver has been popularly selected as die attachment and interconnection material in the next generation of high-power electronics packaging due to its low-temperature sintering and high-temperature operation. Considering the high temperature application condition, the temperature-dependent mechanical behaviors of sintered nanoscale silver have become one of reliability concerns in high power electronics. In this article, the effect of temperature has been combined with a variable fractional model to describe the temperature-dependent mechanical behaviors. The fractional order is physically interpreted by the strain hardening index. The changing law of involved parameters with respect to temperature is also revealed by the proposed model. The model is subsequently modified with a continuously varying fractional order for the whole tensile process instead of the piecewise one. The simulation results and comparisons with existing models exhibit that the modified model presents a simpler formulation without loss of fitting accuracy.

烧结纳米银因其低温烧结和高温操作而被广泛选择作为下一代大功率电子封装中的芯片附着和互连材料。考虑到高温应用条件，烧结纳米级银的温度依赖性机械行为已成为高功率电子产品的可靠性问题之一。在本文中，温度的影响已与可变分数模型相结合，以描述与温度相关的机械行为。该分数阶由应变硬化指数物理解释。所提出的模型还揭示了相关参数相对于温度的变化规律。该模型随后被修改为整个拉伸过程的连续变化的分数阶，而不是分段的。仿真结果和与现有模型的比较表明，修改后的模型提出了更简单的公式，而不会损失拟合精度。