In this work, metallization of copper on acrylonitrile-butadiene-styrene (ABS) substrate has been fabricated by fused deposition modelling (FDM) using electroless process avoiding chemicals detrimental to environment. Four acidic baths containing five weight percentages of HF, H2SO4, HNO3 and H3PO4 varying copper sulphate (CuSO4) at 10, 15 and 20 weight percentage in each bath has been used for metallization. The metallization process in each bath has continued for seventy two hours. Copper coating obtained on the substrate by the use of different baths has been evaluated for electrical resistance, thickness of copper coated layer, percentage of copper present on the coated surface and adhesion performance. Scanning electron microscopy (SEM) and energy dispersion X-ray spectroscopy (EDX) results have indicated that all the baths are quite capable of deposition of copper on ABS substrates. However, HF bath has exhibited superior coating performance as compared to other baths. The thickness of copper coated layer and percentage of copper present in the coated layer has been found to be highest by the use of HF bath with fifteen weight percentage of CuSO4.

中文翻译：

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FDM 制造 ABS 零件化学镀铜的研究

在这项工作中，丙烯腈 - 丁二烯 - 苯乙烯（ABS）基板上的铜金属化已通过熔融沉积建模（FDM）使用化学工艺制造，避免了对环境有害的化学品。四种酸性镀液包含五种重量百分比的 HF、H 2 SO 4 、HNO 3 和 H 3 PO 4 不同的硫酸铜 (CuSO 4 )，每种镀液的重量百分比分别为 10、15 和 20 ％，已用于金属化。每个镀液中的金属化过程持续了七十二小时。通过使用不同的镀液在基材上获得的铜涂层已针对电阻、铜涂层的厚度、涂层表面上存在的铜的百分比和粘附性能进行了评估。扫描电子显微镜 (SEM) 和能量色散 X 射线光谱 (EDX) 结果表明，所有镀液都能在 ABS 基材上沉积铜。然而，与其他浴相比，HF浴表现出优异的涂层性能。已经发现通过使用具有十五重量百分比的 CuSO4 的 HF 浴，铜涂层的厚度和涂层中存在的铜的百分比是最高的。