An innovative crosstalk effect modeling between I and B shape interconnect structure is investigated. The equivalent topology of the victim interconnect line (IL) in proximity of the B-shape line perturbation with three-coupled line (CL) is established. The IB topology S-matrix is calculated as a function of the IL and coupling coefficient parameters from the CL hexapole equivalent black box. The unfamiliar phenomenological analysis on the transmission coefficient antiresonance is associated to particular behavior of group delay. Analytical expression illustrates the relation between the particular phenomenon to the B-IL physical length and crosstalk. The theoretical investigation was confirmed with the victim I-IL transmission coefficient is influenced by the B-line crosstalk. Simulations and measurements with two IB IL microstrip prototypes validate experimentally the established three-CLs-based analytical S-parameter model.

中文翻译：

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包含串扰扰动的 IB 形互连线路的 S 参数模型

研究了 I 形和 B 形互连结构之间的创新串扰效应建模。建立了具有三耦合线（CL）的 B 形线扰动附近的受害互连线（IL）的等效拓扑。IB 拓扑 S 矩阵计算为来自 CL 六极杆等效黑匣子的 IL 和耦合系数参数的函数。对传输系数反共振的陌生现象学分析与群延迟的特定行为有关。解析表达式说明了特定现象与 B-IL 物理长度和串扰之间的关系。理论研究证实了受害 I-IL 传输系数受 B 线串扰的影响。