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Cumulative degradation methodology to predict reliability of electronic systems
Circuit World ( IF 0.9 ) Pub Date : 2021-06-25 , DOI: 10.1108/cw-08-2020-0195
George Thiel , Flavio Griggio , Sanjay Tiku

Purpose

The purpose of this paper is to describe a novel methodology for predicting reliability for consumer electronics or any other hardware systems that experience a complex lifecycle environmental profile.

Design/methodology/approach

This Physics-of-Failure–based three-step methodology can be used to predict the degradation rate of a population using a Monte Carlo approach. The three steps include: using an empirical equation describing the degradation of a performance metric, a degradation consistency condition and a technique to account for cumulative degradation across multiple life-cycle stress conditions (e.g. temperature, voltage, mechanical load, etc.).

Findings

Two case studies are provided to illustrate the methodology including one related to repeated touch-load induced artifacts for displays.

Originality/value

This novel methodology can be applied to a wide range of applications from mechanical systems to electrical circuits. The results can be fed into the several stages of engineering validation to speed up product qualification.



中文翻译:

预测电子系统可靠性的累积退化方法

目的

本文的目的是描述一种预测消费电子产品或任何其他经历复杂生命周期环境状况的硬件系统可靠性的新方法。

设计/方法/途径

这种基于失效物理学的三步法可用于使用蒙特卡罗方法预测群体的退化率。这三个步骤包括:使用描述性能指标退化的经验方程、退化一致性条件和一种技术来说明跨多个生命周期应力条件(例如温度、电压、机械负载等)的累积退化。

发现

提供了两个案例研究来说明该方法,其中一个与重复触摸负载引起的显示器伪影有关。

原创性/价值

这种新颖的方法可应用于从机械系统到电路的广泛应用。结果可以输入到工程验证的几个阶段,以加快产品认证。

更新日期:2021-06-25
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