Main-chain engineering and side-chain engineering approaches used to design and synthesize semiconducting polymers with intrinsic ductility and/or stretchability are introduced in this review, and recent progress in this area is discussed. Main-chain engineering includes (a) conjugation-break spacer (CBS), (b) ternary copolymer, and (c) block copolymer approaches, and side-chain engineering includes (d) Y-shaped side chain, (e) graft copolymer, and (f) cross-linking approaches. A summary of the results obtained by approaches (a)–(f) demonstrates that approaches (a) and (d) tend to provide high charge mobilities (>1 cm²V⁻¹s⁻¹) even at 100% tensile strain. On the other hand, the mechanical properties of films prepared by these methods remain poor, with a high elastic modulus in the range of >0.1 GPa, which causes poor film ductility and stretchability. In contrast, ductile and/or elastic semiconducting materials with extremely low elastic moduli of <0.01 GPa are obtained by approaches (c) and (f), which are used to prepare thermoplastic and cross-linked elastomeric materials, respectively. For semiconducting polymers to be promising candidates in applications such as wearable electronics, electronic skins, and bioelectronics, the trade-off relationship between the electronic and mechanical performance of semiconducting polymers must be prevented by further developing and combining versatile and efficient approaches.

本综述介绍了用于设计和合成具有固有延展性和/或拉伸性的半导体聚合物的主链工程和侧链工程方法，并讨论了该领域的最新进展。主链工程包括（a）共轭断裂间隔（CBS），（b）三元共聚物和（c）嵌段共聚物方法，侧链工程包括（d）Y形侧链，（e）接枝共聚物，和（f）交联方法。通过方法 (a)–(f) 获得的结果总结表明方法 (a) 和 (d) 倾向于提供高电荷迁移率 (>1 cm ² V ^-1 s ^-1) 即使在 100% 拉伸应变下。另一方面，这些方法制备的薄膜力学性能较差，弹性模量>0.1GPa，导致薄膜延展性和拉伸性较差。相比之下，具有 <0.01 GPa 的极低弹性模量的延展性和/或弹性半导体材料是通过方法 (c) 和 (f) 获得的，它们分别用于制备热塑性和交联弹性材料。为了使半导体聚合物成为可穿戴电子产品、电子皮肤和生物电子学等应用中的有前途的候选者，必须通过进一步开发和结合通用且有效的方法来防止半导体聚合物的电子和机械性能之间的权衡关系。