This paper aims to assess the thermal management of a printed circuit board (PCB), as an electronic chipset, with the aid of a mini-channel heat-sink utilizing fluid flow and nano-enhanced phase change materials (NPCMs), as a semi-active/passive technique. The effects of various parameters such as heat fluxes (4, 7, and 10 kW/m²), flow rates (50, 80, and 110 ml/min), PCM types (paraffin 56–58 °C and 46–48 °C), and NPCM types (TiO₂-PCM and Fe₃O₄-PCM) on the transient temperature, thermal resistance, and thermal effectiveness of the heat-sink are disclosed. After successful demonstration of 50 ml/min as the flow rate, the PCB temperature in the case of the heat-sink with the simultaneous fluid flow (50 ml/min) and PCM (paraffin 56–58 °C) and PCM (paraffin 46–48 °C) decreased by 6.5 and 9.5 °C, respectively, in comparison with the water-based heat-sink. Results show that by dispersing TiO₂ and Fe₃O₄ nanoparticles into pure paraffin, the steady-state temperature of the PCB decreased and the heat-sink cooling ability is enhanced as compared to the pure paraffin. The highest temperature reduction (17.9-13.2 °C) and minimum thermal resistance (2.62–3.03 $\frac{°C.m^2}{\mathit{kW}}$) in different cooling systems is seen in the cases of heat-sink with TiO₂-PCM (4% wt.) and Fe₃O₄-PCM (8% wt.).

本文旨在评估作为电子芯片组的印刷电路板 (PCB) 的热管理，借助利用流体流动和纳米增强相变材料 (NPCM) 的微型通道散热器，作为半-主动/被动技术。各种参数的影响，例如热通量（4、7 和 10 kW/m ²）、流速（50、80 和 110 ml/min）、PCM 类型（石蜡 56–58 ° C和 46–48 ° C）C ), 和 NPCM 类型 (TiO ₂ -PCM 和 Fe ₃ O ₄-PCM) 对散热器的瞬态温度、热阻和热效率的影响。在成功演示 50 ml/min 作为流速后，在散热器的情况下 PCB 温度与同时流体流量 (50 ml/min) 和 PCM（石蜡 56–58 °C）和 PCM（石蜡 46 –48 °C) 与水性散热器相比，分别降低了 6.5 和 9.5 °C。结果表明，与纯石蜡相比，通过将TiO ₂和Fe ₃ O ₄纳米颗粒分散到纯石蜡中，PCB的稳态温度降低，散热器冷却能力增强。最高温度降低（17.9-13.2° C）和最低热阻（2.62-3.03$\frac{°C.{米}^2}{\mathit{千瓦}}$) 在具有 TiO ₂ -PCM (4% wt.) 和 Fe ₃ O ₄ -PCM (8% wt.)的散热器的情况下可见于不同的冷却系统。