The performance of modern accelerators has been seriously affected by the electron cloud effect (e-cloud) caused by the accumulation of secondary electrons. Such problem can be effectively eliminated by laser-etching the inner surface of the vacuum chambers of the modern accelerators. In this work, surfaces of oxygen-free copper (OFC) were laser etched following either parallel lines or square-grid pattern with different scanning speeds. The secondary electron yields (SEYs), resistance, and roughness of the etched OFC samples were measured from various directions. The surfaces of etched OFC samples have been proven to form some regularly arranged grooves or cones, the geometries of which are directly related to the etching parameters. As a result, the parallelly etched samples exhibit apparent anisotropy. The sample etched along parallel lines, present higher SEYs, resistance and roughness when measured in the direction perpendicular to the groove-lines. But the sample etched following square-grid have little difference in the two directions and have a lower SEY value than the parallelly etched samples. Moreover, low-speed etching is more favorable to producing large aspect ratio and porosity structures, which is conducive to obtain lower SEY values.

现代加速器的性能已经严重受到二次电子积累引起的电子云效应（e-cloud）的影响。通过对现代加速器真空腔内表面进行激光蚀刻，可以有效地消除此类问题。在这项工作中，无氧铜 (OFC) 的表面按照平行线或方格图案以不同的扫描速度进行激光蚀刻。从各个方向测量蚀刻的 OFC 样品的二次电子产率 (SEY)、电阻和粗糙度。已证明蚀刻的 OFC 样品的表面会形成一些规则排列的凹槽或锥体，其几何形状与蚀刻参数直接相关。结果，平行蚀刻的样品表现出明显的各向异性。沿平行线蚀刻的样品，在垂直于凹槽线的方向上测量时，呈现更高的 SEY、电阻和粗糙度。但是按照方格蚀刻的样品在两个方向上几乎没有差异，并且比平行蚀刻的样品具有更低的SEY值。此外，低速蚀刻更有利于产生大纵横比和孔隙率结构，有利于获得较低的 SEY 值。