Abstract The mobility of edge dislocation in Cu–Ni solid solution alloys within a wide range of temperatures 100–1100 K and Ni concentrations 0–30 at.% is studied by molecular dynamics simulation. Two different regimes of the influence of substitutional Ni atoms on the motion of edge dislocation are observed. In the first regime, in which the velocity of edge dislocation is much less than the shear sound speed, Ni atoms act as barriers and slow the dislocation down. In this regime, the dependence of the edge dislocation velocity on Ni concentration weakens with increasing temperature. In the second regime, in which the dislocation moves faster, with a speed closer to the shear sound speed, Ni atoms accelerate its motion. The latter result is a consequence of higher shear sound speed along the [110] direction of Cu–Ni solid solution alloy associated with higher Ni content. The distance between Shockley partial dislocations representing the core of edge dislocation is analyzed as a function of temperature and Ni concentration. The partial splitting increases with temperature and decreases with Ni concentration. The latter result might be important for predicting strain hardening mechanisms in Cu–Ni alloys.

中文翻译：

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原子尺度Cu-Ni固溶体合金中刃位错的动力学

摘要 通过分子动力学模拟研究了 Cu-Ni 固溶体合金在 100-1100 K 和 Ni 浓度 0-30 at.% 范围内的刃位错迁移率。观察到替代镍原子对边缘位错运动的影响的两种不同方式。在第一种状态下，边缘位错的速度远小于剪切声速，Ni 原子充当屏障并减缓位错。在这种情况下，边缘位错速度对 Ni 浓度的依赖性随着温度的升高而减弱。在第二种情况下，位错移动得更快，速度更接近剪切声速，Ni 原子加速其运动。后一个结果是沿 [110] 方向的较高剪切声速与较高 Ni 含量相关的 Cu-Ni 固溶体合金的结果。代表边缘位错核心的肖克利部分位错之间的距离被分析为温度和 Ni 浓度的函数。部分分裂随温度增加而增加，随Ni浓度而减少。后一个结果可能对预测 Cu-Ni 合金的应变硬化机制很重要。