Organic single crystals (OSCs) have received increasing interest in the last decades for their potential applications in flexible electronics. Although there are various additive manufacturing methods of organic electronics, the subtractive manufacturing of OSCs is still a challenge, since OSCs are assembled via weak van-der-Waals interactions which are vulnerable and cannot afford damages and degradation of performances after the process. Here, we develop an epitaxial etching strategy which clips the OSCs and keeps high-quality crystalline nature of the resulting materials. As a result, high-quality organic micro-ribbon arrays are fabricated which maintains 89% charge mobility in average compared with original OSCs, showing great potential of this subtractive manufacturing method in future organic electronics.

在过去的几十年中，有机单晶 (OSC) 因其在柔性电子产品中的潜在应用而受到越来越多的关注。尽管有机电子产品有多种增材制造方法，但 OSC 的减材制造仍然是一个挑战，因为 OSC 是通过以下方式组装的弱范德瓦尔斯相互作用是脆弱的，不能承受过程后的损坏和性能下降。在这里，我们开发了一种外延蚀刻策略，该策略可以夹住 OSC 并保持所得材料的高质量结晶性质。结果，制造了高质量的有机微带阵列，与原始 OSC 相比，平均保持 89% 的电荷迁移率，显示了这种减法制造方法在未来有机电子产品中的巨大潜力。