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Developing a Speckle Pattern to Evaluate Adhesive Joints Using Digital Image Correlation
Research in Nondestructive Evaluation ( IF 1.4 ) Pub Date : 2019-08-03 , DOI: 10.1080/09349847.2019.1645253
Seyed Fouad Karimian 1 , Tsuchin Philip Chu 2
Affiliation  

ABSTRACT Digital Image Correlation (DIC) is a known Non-Destructive Evaluation (NDE) method used in various industries. DIC requires a randomly produced pattern, known as speckle pattern, to track and generate strain maps. The speckle patterns are fundamental for DIC applications. DIC uses images of these speckle patterns before and after a load has been applied to generate strain maps by comparing the changes between speckle pattern images. In this study, a speckle pattern is sought to implement within adhesive joints. The speckle pattern must be trackable using ultrasonic imaging; therefore, it is chosen from materials with high acoustic impedance metals. By tracking the speckle pattern and using DIC, defects within joints will be revealed. This allows non-destructive analysis to be conducted on adhesive joints to detect defects which may go undetected using conventional ultrasonic techniques.

中文翻译:

开发散斑图案以使用数字图像相关性评估粘合接头

摘要 数字图像相关 (DIC) 是一种已知的无损评估 (NDE) 方法,用于各种行业。DIC 需要随机产生的图案,称为散斑图案,以跟踪和生成应变图。散斑图案是 DIC 应用的基础。通过比较散斑图案图像之间的变化,DIC 使用施加载荷前后这些散斑图案的图像来生成应变图。在这项研究中,试图在粘合接头内实施散斑图案。必须使用超声波成像跟踪散斑图案;因此,它选自具有高声阻抗金属的材料。通过跟踪散斑图案并使用 DIC,将揭示接头内的缺陷。
更新日期:2019-08-03
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