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Tailoring the Micro-galvanic Dissolution Behavior and Antifouling Performance Through Laminated-Structured Cu-X Composite Coating
Journal of Thermal Spray Technology ( IF 3.1 ) Pub Date : 2021-06-16 , DOI: 10.1007/s11666-021-01211-0
Kai Wang , Kangwei Xu , Jiajia Tian , Zhenzhen Li , Guosheng Shao

Marine biofouling is a ubiquitous and serious problem in maritime engineering. Here, we reported an effective antifouling approach through facile fabrication of laminated-structured Cu-X composite coatings by plasma spraying of mechanically blended Cu and X powders, in which X is a type of metal nobler than Cu. The Cu-X coatings were designed to controlled release Cu ions from Cu/X micro-galvanic cells and thus to achieve long-term and effective antifouling performance. The effect of cathode X composition (i.e., Ni, stainless steel (SS), and Ti) on the micro-galvanic dissolution behavior and antifouling performance of the Cu-X coatings was systematically investigated. Results indicated that the cathode X composition exhibited little influence on the micro-galvanic dissolution mechanism of Cu-X coatings. Nevertheless, Cu ions release rate increased as follows: Cu-Ni coating < Cu-SS coating < Cu-Ti coating. Moreover, the Cu-X composite coatings exhibited long-lasting antifouling capability and remarkable antifouling efficiency of ~100%. Electrochemical test results revealed that the potential difference between Cu/X was the primary factor determining the difference of Cu dissolution rate and thus the Cu ions release rate between different Cu-X coatings. These results would open a new window for designing long-term and environment-friendly Cu-X antifouling coatings by employing various tunable bimetals.



中文翻译:

通过层压结构的 Cu-X 复合涂层定制微电流溶解行为和防污性能

海洋生物污染是海洋工程中普遍存在的严重问题。在这里,我们报告了一种有效的防污方法,通过等离子喷涂机械混合的 Cu 和 X 粉末,其中 X 是一种比 Cu 贵的金属,从而轻松制造层压结构的 Cu-X 复合涂层。Cu-X 涂层旨在从 Cu/X 微原电池中控制释放 Cu 离子,从而实现长期有效的防污性能。系统地研究了阴极 X 成分(即 Ni、不锈钢 (SS) 和 Ti)对 Cu-X 涂层的微电流溶解行为和防污性能的影响。结果表明,阴极 X 组成对 Cu-X 涂层的微电流溶解机制几乎没有影响。尽管如此,Cu离子释放速率增加如下:Cu-Ni涂层<Cu-SS涂层<Cu-Ti涂层。此外,Cu-X复合涂层表现出持久的防污能力和~100%的显着防污效率。电化学测试结果表明,Cu/X之间的电位差是决定不同Cu-X涂层之间Cu溶解速率和Cu离子释放速率差异的主要因素。这些结果将为通过采用各种可调双金属设计长期和环境友好的 Cu-X 防污涂层打开一扇新窗口。电化学测试结果表明,Cu/X之间的电位差是决定不同Cu-X涂层之间Cu溶解速率和Cu离子释放速率差异的主要因素。这些结果将为通过采用各种可调双金属设计长期和环境友好的 Cu-X 防污涂层打开新的窗口。电化学测试结果表明,Cu/X之间的电位差是决定不同Cu-X涂层之间Cu溶解速率和Cu离子释放速率差异的主要因素。这些结果将为通过采用各种可调双金属设计长期和环境友好的 Cu-X 防污涂层打开新的窗口。

更新日期:2021-06-17
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