Purpose This paper aims to present an effective approach to integrated circuit (IC) throughput enhancement, called TΔT thermal control. It does not require any micro-architectural change of the IC. The only modification is the attachment of an additional temperature sensor at the heatsink boundary. TΔT control technique enables assessment of changes in the dimension of cooling conditions and quick reaction to the dynamic changes in the surrounding environment. As a result, the chip can operate flexibly while minimizing thermal violation. Design/methodology/approach Using additional knowledge about the surroundings, the on-chip temperature is regulated. The approach is first investigated theoretically. To validate the utilized thermal model, the measured temperature values of the designed and fabricated testing device are compared with the simulated one. The authors evaluated the impact of the additional sensor location on the reaction time (RT). Using the Spice model, further investigation helps to verify the hypothesis. Findings The control technique described in this paper showed that the temperature of the chip can be regulated using an additional knowledge of the surrounding environment. It has also been demonstrated that the attachment of an additional temperature sensor close to the cooled surface of the package enables TΔT thermal control technique to react faster (rapid powering up/down of the IC). Therefore, this lowers the risk of shutdown while keeping the temperature close to the thermal limit (the maximal temperature of the chip) for a significant period. The simulation results showed that a higher ambient temperature leads to diminution of the interval in which the on-chip temperature stays almost constant when TΔT technique is used (time shift). Originality/value In this study, a new thermal throttling technique that uses the full physical ability of the chip operating under thermal constraint has been evaluated.

中文翻译：

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提高微处理器吞吐量的有效途径

目的 本文旨在提出一种提高集成电路 (IC) 吞吐量的有效方法，称为 TΔT 热控制。它不需要对 IC 进行任何微架构更改。唯一的修改是在散热器边界处附加了一个额外的温度传感器。TΔT 控制技术能够评估冷却条件的维度变化，并对周围环境的动态变化做出快速反应。因此，芯片可以灵活运行，同时最大限度地减少热破坏。设计/方法/途径 使用有关周围环境的额外知识，可以调节片上温度。首先从理论上研究该方法。为了验证所使用的热模型，将设计和制造的测试装置的测量温度值与模拟装置的温度值进行比较。作者评估了附加传感器位置对反应时间 (RT) 的影响。使用 Spice 模型，进一步调查有助于验证假设。发现 本文中描述的控制技术表明，可以使用对周围环境的额外知识来调节芯片的温度。还证明，靠近封装冷却表面的附加温度传感器的连接使 TΔT 热控制技术能够更快地做出反应（IC 的快速通电/断电）。因此，这降低了关闭的风险，同时在相当长的一段时间内将温度保持在接近热极限（芯片的最高温度）。仿真结果表明，当使用 TΔT 技术（时移）时，较高的环境温度会导致片上温度几乎保持恒定的时间间隔缩短。原创性/价值 在这项研究中，评估了一种新的热节流技术，该技术利用了在热约束下运行的芯片的全部物理能力。