This paper describes the outcome of the “Small user TErminal multi band DIplexer” project where the goal is the validation of novel SMD-compliant planar diplexer. The real application scenario concerns an integrated multi-band radio terminal for ground-segment satellite links. The advantageous and novel approach involves the simultaneous use of three different well-established concepts: a microstrip low-pass filter, a substrate integrated waveguide high-pass filter, and the thin-film technology as manufacturing process. The proposed topology applied to a planar alumina-based design guarantees a 15 × 11.1 mm2 footprint and the best integration with surface mountable soldering process over standard PCB technology. Achieved performance and resilience to environmental toughness are suitable for consumer-oriented satellite links or man-pack applications. The designed component targets the Ku 10.7–12.75 (RX) and Ka 27.5–30 (TX) GHz bands but the layout can be easily tuned across the spectrum. The described solution has been manufactured and validated. Thermal cycling and mechanical tests have been carried out to prove the high technology readiness level of the proposed device.

本文描述了“小用户终端多频段双工器”项目的成果，该项目的目标是验证新型 SMD 兼容平面双工器。实际应用场景涉及地面段卫星链路的集成多频段无线电终端。有利和新颖的方法涉及同时使用三个不同的成熟概念：微带低通滤波器、衬底集成波导高通滤波器和作为制造工艺的薄膜技术。建议的拓扑应用于平面氧化铝基设计可确保 15 × 11.1 mm 2占位面积和与标准 PCB 技术的表面贴装焊接工艺的最佳集成。实现的性能和对环境韧性的弹性适用于面向消费者的卫星链路或单人背包应用。设计的组件针对 Ku 10.7–12.75 (RX) 和 Ka 27.5–30 (TX) GHz 频段，但布局可以在整个频谱范围内轻松调整。所描述的解决方案已经制造和验证。已经进行了热循环和机械测试，以证明所提出设备的高技术准备水平。