Shape memory epoxy resin (SMEP) with tailorable properties has gained wide attention. Herein, a series of photocured diphenyl epoxy with excellent shape memory effects, based on the epoxy monomer diglycidyl ether of biphenyl (DGEBP) and M-xylylenediamine (MXDA), is fabricated. Fourier transform infrared spectrometer (FTIR) is used to verify the mix-curing process. Differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), polarized light microscope (POM), and X-ray diffraction (XRD) are applied to analyze the microstructure of the film. The molar ratio of the raw material and the post-heating could tune the crosslinking density, which allows the prepared epoxy resin to present a tailorable shape memory effect. Besides, this epoxy resin exhibits an excellent triple-shape memory effect due to the wide transition temperature. It is worth of noting that post-heating induced the self-assembly of biphenyl unit of the lamellar structure due to π–π interactions that causes an adjustable shape memory effect. This work offers a novel SMEP with potential application in the thermal history trace field.

中文翻译：

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具有后加热可调性能的含联苯形状记忆环氧树脂

具有可定制特性的形状记忆环氧树脂 (SMEP) 已引起广泛关注。在此，基于环氧单体联苯二缩水甘油醚（DGEBP）和间苯二甲胺（MXDA），制备了一系列具有优异形状记忆效应的光固化联苯环氧树脂。傅里叶变换红外光谱仪 (FTIR) 用于验证混合固化过程。采用差示扫描量热法（DSC）、动态力学分析（DMA）、偏光显微镜（POM）和X射线衍射（XRD）对薄膜的微观结构进行分析。原料的摩尔比和后加热可以调节交联密度，使制备的环氧树脂呈现可定制的形状记忆效应。此外，由于转变温度宽，这种环氧树脂表现出优异的三重形状记忆效应。π – π相互作用导致可调节的形状记忆效应。这项工作提供了一种在热历史跟踪领域具有潜在应用的新型 SMEP。