Diamond wire sawing has obtained 90% of the single-crystal silicon–based photovoltaic market, mainly for its high production efficiency, high wafer quality, and low tool wear. The diamond wire wear is strongly influenced by the temperatures in the grain-workpiece contact zone; and yet, research studies on experimental investigations and modeling are currently lacking. In this direction, a temperature model is developed for the evaluation of the flash temperatures at the grain tip with respect to the grain penetration depth. An experimental single-grain scratch test setup is designed to validate the model that can emulate the long contact lengths as in the wire sawing process, at high speeds. Furthermore, the influence of brittle and ductile material removal modes on cutting zone temperatures is evaluated.

金刚石线锯获得了单晶硅基光伏市场90%的份额，主要是因为其生产效率高、晶圆质量高、工具磨损小。金刚石线磨损受晶粒-工件接触区温度的强烈影响；然而，目前缺乏对实验调查和建模的研究。在这个方向上，开发了一个温度模型，用于评估晶粒尖端的闪蒸温度与晶粒穿透深度的关系。实验性单晶粒划痕测试装置旨在验证模型，该模型可以高速模拟线锯过程中的长接触长度。此外，评估了脆性和韧性材料去除模式对切削区温度的影响。