With the trend of integration, miniaturization, and increasing power density of stretchable electronic devices, real-time thermal dissipation is becoming crucial. Seeking materials and/or structures with advanced thermal management for stretchable electronics becomes an urgent issue. For passive thermal management, the traditional thermal interfacial materials (TIMs) with flexibility cannot meet the demand of stretchable electronics, because stretchable devices are usually required to experience a large scale of bending, twisting, stretching, and so on. The main challenge facing thermal management for stretchable electronics is how to maintain stable thermal conductance under large deformation. Here, we examine the development of materials and structures available in this field. We also propose a comparative analysis of the existing challenges and provide possible solutions for the thermal management of stretchable electronics in the future.

随着可伸缩电子设备的集成化、小型化和功率密度的提高，实时散热变得至关重要。为可拉伸电子设备寻找具有先进热管理的材料和/或结构成为一个紧迫的问题。对于被动热管理，具有柔性的传统热界面材料 (TIM) 无法满足可拉伸电子设备的需求，因为可拉伸设备通常需要经历大规模的弯曲、扭曲、拉伸等。可拉伸电子产品的热管理面临的主要挑战是如何在大变形下保持稳定的热导率。在这里，我们研究了该领域可用的材料和结构的开发。