High-performance cyanate ester (CE) resins with excellent dielectric properties are highly desired in the fields of information and communication technology. Herein, we present an efficient strategy for the preparation of low-k and wave-transparent CE resins modified with a novel kind of bismaleimide (BMI) hollow polymer microspheres (BMI-HPPs). Benefiting from both the superior properties of BMI and the unique hollow structure, BMI-HPPs can serve as an effective modifier to reduce dielectric constant (ε) of the CE resins and simultaneously improve their toughness. There are plenty of pendant vinyl groups and unreacted maleimide groups on the surface of BMI-HPPs, which could effectively copolymerize with CE monomer, leading to a lower curing temperature and better interfacial compatibility. The BMI-HPPs/CE resin with 7.5 wt% BMI-HPPs exhibited minimum values of ε and dielectric loss (tanδ) (2.46, 0.006) at 16 GHz, much lower than those of the pristine CE resin (2.92, 0.018), and the corresponding wave transmission was 93.8%–97.1% in the frequency range of 15–18 GHz. Moreover, the modified CE resin showed a maximum impact strength of 18.8 kJ/m² at 5 wt% loading of BMI-HPPs, which is 64% higher than that of the pristine CE resin. Because of low-k dielectric properties, superior wave-transparent performance and highly enhanced toughness, the BMI-HPPs/CE resins have great potential in the fields of microelectronics and aerospace.

信息和通信技术领域非常需要具有优异介电性能的高性能氰酸酯 (CE) 树脂。在此，我们提出了一种制备低k 值的有效策略以及用新型双马来酰亚胺 (BMI) 中空聚合物微球 (BMI-HPP) 改性的透波 CE 树脂。得益于 BMI 的优越性能和独特的中空结构，BMI-HPPs 可以作为一种有效的改性剂来降低 CE 树脂的介电常数 (ε)，同时提高其韧性。BMI-HPPs表面有大量的乙烯基侧基和未反应的马来酰亚胺基团，可与CE单体有效共聚，固化温度更低，界面相容性更好。具有 7.5 wt% BMI-HPPs 的 BMI-HPPs/CE 树脂在 16 GHz 下表现出 ε 和介电损耗 (tanδ) (2.46, 0.006) 的最小值，远低于原始 CE 树脂 (2.92, 0.018) 和在 15–18 GHz 的频率范围内，相应的波传输率为 93.8%–97.1%。²在 5 wt% 的 BMI-HPP 负载下，比原始 CE 树脂高 64%。因为低的ķ介电性能，优异的透波性能和高度增强的韧性，该BMI-高潜质/ CE树脂具有在微电子和航空航天领域的巨大潜力。