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Activation energy for Cu-Sn intermetallic in CNT-reinforced Sn-1.0Ag-0.5Cu solder
Soldering & Surface Mount Technology ( IF 2 ) Pub Date : 2019-11-01 , DOI: 10.1108/ssmt-07-2019-0025
Ramani Mayappan , Amirah Salleh , Nurul Atiqah Tokiran , N.A. Awang

The purpose of this study is to investigate the addition of 0.05 Wt.% carbon nanotube (CNT) into the Sn-1.0Ag-0.5Cu (SAC) solder on the intermetallic (IMC) growth. Lead-based solders play an important role in a variety of applications in electronic industries. Due to the toxicity of the lead in the solder, lead-free solders were proposed to replace the lead-based solders. Sn-Ag-Cu solder family is one of the lead-free solders, which are proposed and considered as a potential replacement. Unfortunately, the Sn-Ag-Cu solder faces some reliability problems because of the formation of the thick intermetallic compounds. So the retardation of intermetallic growth is prime important.,The solder joint was aged under liquid state aging with soldering time from 1 to 60 min.,Two types of intermetallics, which are Cu6Sn5 and Cu3Sn were observed under a scanning electron microscope. The morphology of Cu6Sn5 intermetallic transformed from scallop to planar type as the soldering time increases. The addition of carbon nanotube into the SAC solder has retarded the Cu6Sn5 intermetallic growth rate by increasing its activation energy from 97.86 to 101.45 kJ/mol. Furthermore, the activation energy for the Cu3Sn growth has increased from 102.10 to 104.23 kJ/mol.,The increase in the activation energy indicates that the growth of the intermetallics was slower. This implies that the addition of carbon nanotube increases the reliability of the solder joint and are suitable for microelectronics applications.

中文翻译:

碳纳米管增强型 Sn-1.0Ag-0.5Cu 焊料中 Cu-Sn 金属间化合物的活化能

本研究的目的是研究在金属间化合物 (IMC) 生长过程中将 0.05 Wt.% 碳纳米管 (CNT) 添加到 Sn-1.0Ag-0.5Cu (SAC) 焊料中的情况。铅基焊料在电子行业的各种应用中发挥着重要作用。由于焊料中铅的毒性,有人提议用无铅焊料代替铅基焊料。Sn-Ag-Cu 焊料系列是一种无铅焊料,被提议并被认为是潜在的替代品。不幸的是,由于形成厚金属间化合物,Sn-Ag-Cu 焊料面临一些可靠性问题。因此,金属间化合物生长的延迟是最重要的。,焊点在液态时效下进行时效,焊接时间为 1 到 60 分钟。两种类型的金属间化合物,在扫描电子显微镜下观察到的是 Cu6Sn5 和 Cu3Sn。随着焊接时间的增加,Cu6Sn5 金属间化合物的形态从扇贝形转变为平面型。将碳纳米管添加到 SAC 焊料中,通过将其活化能从 97.86 kJ/mol 增加到 101.45 kJ/mol,延缓了 Cu6Sn5 金属间化合物的生长速度。此外,Cu3Sn 生长的活化能从 102.10 kJ/mol 增加到 104.23 kJ/mol。活化能的增加表明金属间化合物的生长较慢。这意味着碳纳米管的添加提高了焊点的可靠性,适用于微电子应用。将碳纳米管添加到 SAC 焊料中,通过将其活化能从 97.86 kJ/mol 增加到 101.45 kJ/mol,延缓了 Cu6Sn5 金属间化合物的生长速度。此外,Cu3Sn 生长的活化能从 102.10 kJ/mol 增加到 104.23 kJ/mol。活化能的增加表明金属间化合物的生长较慢。这意味着碳纳米管的添加提高了焊点的可靠性,适用于微电子应用。将碳纳米管添加到 SAC 焊料中,通过将其活化能从 97.86 kJ/mol 增加到 101.45 kJ/mol,延缓了 Cu6Sn5 金属间化合物的生长速度。此外,Cu3Sn 生长的活化能从 102.10 kJ/mol 增加到 104.23 kJ/mol。活化能的增加表明金属间化合物的生长较慢。这意味着碳纳米管的添加提高了焊点的可靠性,适用于微电子应用。
更新日期:2019-11-01
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