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In-process monitoring of microscale grain protrusions by tracing impulse-discharge energy related to thermal transmission balance on diamond cutting interface
Journal of Materials Processing Technology ( IF 6.3 ) Pub Date : 2021-06-09 , DOI: 10.1016/j.jmatprotec.2021.117256
Quanpeng He , Jin Xie , Jiajun Huang , Hao Yang , Xinyu Xu

Stable ground surface depends on abrasive grain protrusions, but it has no way to monitor the wheel topographical state during grinding. Generally, the charge coupled device (CCD) monitoring is employed to on-machine measure 2D grain protrusions, but the whole wheel micro-topography has not been recognized in-process. In the electro-contact discharge (ECD) truncating of diamond wheel, a thermal transmission balance on diamond cutting interface is proposed to identify the diamond thermochemical removal. Accordingly, the impulse-discharge energy is characterized by discharge waveforms to relate to the microscale grain protrusion topography. The objective is to advance surface grinding by in-process monitoring the whole protrusion topography rather than by on-machine measuring the partial wheel topography. First, the grain top height and area were modeled by the microscale spark-discharge gap and the microsecond grain truncating duration, respectively; then, the influence of kinematic variables and electrical variables on discharge parameters was analyzed to regulate the impulse-discharge energy; finally, the thermochemical removal rate was traced along with the grain protrusion parameters for ground surface quality. It is shown that the diamond thermochemical removal may be regulated by kinematic variables and electrical variables. At the dynamic thermal transmission balance of impulse-discharge energy on diamond cutting interface, the thermochemical removal rate gradually tends to zero, leading to stable grain top height and area for a stable ground surface. As a result, the grain top height and area on the whole wheel surface may be monitored under the critical discharge parameters in relation to grain size during ECD truncating.



中文翻译:

通过跟踪与金刚石切割界面热传递平衡相关的脉冲放电能量,对微尺度晶粒突起进行过程监测

稳定的磨削表面依赖于磨粒突起,但在磨削过程中无法监测砂轮的形貌状态。通常,电荷耦合器件(CCD)监测用于在机测量2D晶粒突起,但尚未在过程中识别整个车轮微形貌。在金刚石砂轮的电接触放电(ECD)截断中,提出了金刚石切割界面的热传递平衡来识别金刚石热化学去除。因此,脉冲放电能量的特征是放电波形与微尺度晶粒突起形貌有关。目的是通过在过程中监控整个突起形貌而不是通过在机上测量部分砂轮形貌来推进表面磨削。第一的,晶粒顶部高度和面积分别由微尺度火花放电间隙和微秒晶粒截断持续时间建模;然后,分析了运动学变量和电学变量对放电参数的影响,以调节脉冲放电能量;最后,跟踪热化学去除率以及用于地面质量的颗粒突起参数。结果表明,金刚石热化学去除可能受运动学变量和电学变量的调节。在金刚石切削界面脉冲-放电能量的动态传热平衡下,热化学去除率逐渐趋于零,导致稳定的磨粒顶高和面积稳定地表面。因此,

更新日期:2021-06-15
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