Nb deposited by magnetron sputtering onto hot Cu-15 wt.%Sn bronze substrates at temperatures above 700 C achieved Nb₃Sn film growth at a rate of 33 nm min⁻¹, which was an order of magnitude faster than that achieved for deposition of Nb on bronze at low temperature followed by in situ post reaction at the same high temperatures. Tin content in the Nb₃Sn films made on hot bronze was ∼26.3%, which is significantly higher than ∼24.5% obtained by post-reaction as well as for typical bulk reactions between Nb and α-bronze. The Nb₃Sn lattice parameter was consistent with measured tin content and predicted elastic strain for both routes. Critical temperatures of 14 K–16 K, instead of 18 K, were consistent with elastic strain due to coefficient of thermal expansion mismatch between the Nb₃Sn and bronze substrate and, for the hot-bronze samples, stress related to the growth mechanism. Films were fully coalesced and had surface roughness values <20 nm over a 100 μm² scan. Grain structure of the Nb₃Sn films produced by Nb sputtering on hot bronze resembles zone 2 in the Thornton structure-zone diagram, in contrast to the equiaxed grain structure reminiscent of microstructure observed in reacted Nb₃Sn wires exhibited by the post-reaction route.

在高于 700 C 的温度下，通过磁控管溅射将 Nb 沉积到热的 Cu-15 wt.% Sn 青铜基材上，Nb ₃ Sn 膜的生长速度为 33 nm min ^-1，这比沉积Nb 在低温下在青铜上进行，然后在相同的高温下进行原位后反应。在热青铜上制备的 Nb ₃ Sn 薄膜中的锡含量为~26.3%，明显高于通过后反应以及 Nb 与α-青铜之间的典型本体反应获得的~24.5% 。铌₃Sn 晶格参数与测量的锡含量和预测的两种路线的弹性应变一致。由于 Nb ₃ Sn 和青铜基板之间的热膨胀系数不匹配，以及对于热青铜样品，与生长机制相关的应力，临界温度为 14 K-16 K，而不是 18 K，这与弹性应变一致。膜充分聚结并具有的表面粗糙度值<超过100 20nm的μ中号²扫描。通过 Nb 溅射在热青铜上产生的 Nb ₃ Sn 薄膜的晶粒结构类似于 Thornton 结构-区域图中的区域 2，与在反应的 Nb _{3 中}观察到的让人联想到微观结构的等轴晶粒结构形成对比后反应路线展示的锡线。