In recent years, SiCp/Al metal matrix composites (MMCs) have attracted increasing attention from academia and industry. The size and distribution of particles in this material have an important effect on its actual performance. First, the geometric analysis of milling is performed. A two-dimensional micro finite element model consisting of hard SiC particles and a soft aluminum matrix is established to study the milling of SiCp/Al composites. In this paper, the cutting mechanism of SiCp/Al MMCs reinforced by a uniform distribution of particles of the same size and random distribution of non-equal size particles at the micron level was compared by using the finite element method and finite element model with a zero-thickness cohesive layer. The simulation results show that same-size particles are evenly distributed in the matrix, and good stress distribution and chip morphology can be obtained. In addition, the cutting force fluctuation is small, and the machining surface quality is good. The properties of Al-based SiC composites can be improved by evenly distributing same-size particles. Considering the particle size and distribution, the random model can more accurately simulate the chip, cutting force fluctuation of the workpiece, and workpiece surface damage than the uniform model. A good correlation between the research results and experimental results is shown in the literature.

近年来，SiCp/Al金属基复合材料（MMCs）越来越受到学术界和工业界的关注。这种材料中颗粒的大小和分布对其实际性能有重要影响。首先，进行铣削的几何分析。建立了由硬质 SiC 颗粒和软质铝基体组成的二维微观有限元模型，以研究 SiCp/Al 复合材料的铣削。本文利用有限元方法和有限元模型，比较了均匀分布的相同粒径颗粒和随机分布的非等粒径颗粒在微米级增强的SiCp/Al MMCs的切割机理。零厚度粘合层。模拟结果表明，相同大小的颗粒均匀分布在基体中，并且可以获得良好的应力分布和芯片形貌。此外，切削力波动小，加工表面质量好。均匀分布相同尺寸的颗粒可以提高铝基碳化硅复合材料的性能。考虑到粒度和分布，随机模型比均匀模型可以更准确地模拟切屑、工件的切削力波动和工件表面损伤。研究结果与实验结果之间具有良好的相关性，见于文献。与均匀模型相比，随机模型可以更准确地模拟切屑、工件切削力波动和工件表面损伤。研究结果与实验结果之间具有良好的相关性，见于文献。与均匀模型相比，随机模型可以更准确地模拟切屑、工件切削力波动和工件表面损伤。研究结果与实验结果之间具有良好的相关性，见于文献。