The current study deals with the numerical investigation of the substrate board characteristics using different materials (FR₄, silicon cladding and copper cladding) on which nine nonidentical electronic components (ECs) are mounted, which are supplied with nonuniform heat flux. The study is conducted for natural and forced convection (3m/s and 5m/s) modes of heat transfer. It is observed that for 5m/s the temperature of the ECs is dropped by 30–47^∘C using copper cladding board in comparison to FR₄ and silicon cladding board. It is also noted that with the use of copper cladding board the velocity of air required for cooling the ECs is substantially reduced by 2m/s and the temperature of the IC chip is reduced by 1.50–11.12^∘C.

中文翻译：

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基板热导率对电子元件温度控制的影响：数值研究

_{目前的研究涉及使用不同材料（FR 4} 、硅覆层和铜覆层）对基板特性进行数值研究，九个不同的电子元件 (EC) 安装在这些材料上，并提供不均匀的热通量。该研究针对自然对流和强制对流（3米/秒和 5m/s) 传热模式。据观察，对于 5_{与 FR 4}和硅覆层板相比，使用覆铜板m/s 时，EC 的温度下降了 30–47 ^{∘ C。}还应注意的是，使用覆铜板，冷却 EC 所需的空气速度大大降低了 2m/s，IC芯片温度降低^{1.50-11.12∘C}。