ABSTRACT

In this research, transient liquid phase (TLP) bonding of IN718 and SS316L dissimilar alloys was carried out using MBF-20 amorphous interlayer. The effects of bonding temperature and time ranging from 1030°C to 1110°C and 1–30 min on the microstructure and mechanical properties of the bonded samples were studied. The mechanism of the microstructure formation and the solidification sequence at the joint area were discussed. Two diffusion models assuming stationary and moving solid/liquid interface were used to study the isothermal solidification kinetics and the time required for the complete isothermal solidification (t_f) at different temperatures was predicted. The results suggest that the t_f values obtained by the moving interface approach are closer to those of the experiments. The minimum difference between the experimental value of t_f and that calculated by the moving interface approach was about 26%, while it was about 106% by considering the stationary interface approach. A more uniform hardness distribution across the joint area and the highest shear strength values were observed in the samples with complete isothermal solidification. The maximum shear strength of 440 MPa was obtained for the sample bonded at 1030°C for 30 min. This was attributed to the formation of a eutectic-free joint in these samples.

摘要

在本研究中，使用 MBF-20 非晶夹层对 IN718 和 SS316L 异种合金进行瞬态液相 (TLP) 键合。研究了在 1030°C 到 1110°C 和 1-30 分钟范围内的粘合温度和时间对粘合样品的微观结构和机械性能的影响。讨论了接头区组织的形成机理和凝固顺序。假设固定和移动固/液界面的两个扩散模型用于研究等温凝固动力学，并预测在不同温度下完全等温凝固所需的时间 (t _f )。结果表明，t _f通过移动界面方法获得的值更接近实验的值。t _f的实验值与通过移动界面方法计算的值之间的最小差异约为26%，而考虑到静止界面方法则约为106%。在完全等温凝固的样品中观察到在接头区域更均匀的硬度分布和最高的剪切强度值。在 1030°C 下粘合 30 分钟的样品获得了 440 MPa 的最大剪切强度。这归因于在这些样品中形成了无共晶接头。