To study the effect of nanoparticles on strengthening the transient liquid phase (TLP) joints of AZ31 alloy, different interlayers including pure copper, pure copper+TiO₂ nanoparticles, pure copper+Al₂O₃ nanoparticles and pure copper+SiC nanoparticles were used. The pure copper was coated on the surfaces to be joined via electroplating. The samples were TLP bonded at 525 °C for 1 and 2 h under the pressure of 1 MPa, in an atmosphere-controlled furnace. After that, the microstructure of the joints were studied using optical and scanning electron microscopy and phase analysis as conducted using Energy-dispersive X-ray spectroscopy. The joints' shear strength was evaluated via a tensile test machine equipped with a special designed fixture and X-Ray Diffraction was utilized to analyze the related fracture surfaces. Microstructural studies showed that athermal solidification induced eutectic compounds at the joints were reduced with increasing bonding time and therefore, the isothermal solidification became more completed. This also increased the homogenity and uniformity of the microstructure and the joint's shear strength. The highest and lowest shear strength was observed for the joints made using pure copper+TiO₂ nanoparticles and pure copper+SiC nanoparticles-containing interlayers, respectively, about 90% and 15% of the base metal's shear strength. Also, the shear strength of the joints made using pure copper+Al₂O₃ nanoparticles was higher for the 20 nm particles, compared to the 50 nm ones.

为了研究纳米粒子对强化AZ31合金的瞬时液相（TLP）接头的影响，研究了包括纯铜，纯铜+ TiO ₂纳米粒子，纯铜+ Al ₂ O ₃在内的不同中间层使用了纳米颗粒和纯铜+ SiC纳米颗粒。将纯铜涂覆在要通过电镀连接的表面上。将样品在1兆帕的压力下在气氛控制的炉中于525°C进行TLP粘合1和2小时。之后，使用光学和扫描电子显微镜以及使用能量色散X射线光谱法进行的相分析研究了接头的微观结构。通过配备了特殊设计夹具的拉伸试验机评估了接头的剪切强度，并利用X射线衍射分析了相关的断裂表面。显微组织研究表明，随着结合时间的增加，接头处由热固化引起的共晶化合物减少，因此，等温固化变得更加完整。这也增加了微观结构的均匀性和均匀性以及接头的剪切强度。对于使用纯铜+ TiO制成的接头，观察到了最高和最低的剪切强度_2个纳米颗粒和含纯铜+ SiC纳米颗粒的中间层分别约为母材的剪切强度的90％和15％。另外，使用纯铜+ Al ₂ O ₃纳米颗粒制成的接头的抗剪强度，与50 nm的颗粒相比，在20 nm的颗粒中更高。