The influence of the stagnation temperature of the accelerating gas flow and that of nozzle travel speed on the deposition efficiency are studied when depositing single Cu-coating tracks by the cold spray technique. The experiments performed clearly show that the nozzle traverse speed substantially affects the value of measured deposition efficiency: the higher is the nozzle traverse speed, the lesser the measured deposition efficiency turns out to be at all other things being identical. Such a behavior can be explained by the fact that the first impacts of particles onto the substrate do not lead to their adhering to the surface and, hence, to coating deposition. It is known that, before the coating starts to grow, it is necessary for the substrate surface to be subjected to a sufficient number of particle impacts. This preparatory stage is called the activation stage, or the delay (induction) stage of the deposition process. It is shown for the first time that the specific (per unit area) mass of the powder consumed at the activation stage depends on the stagnation temperature of the accelerating gas flow: the higher is the stagnation temperature, the lower is the specific mass consumed.

研究了通过冷喷涂技术沉积单条镀铜迹线时，加速气流的停滞温度和喷嘴行进速度对沉积效率的影响。进行的实验清楚地表明，喷嘴的横向移动速度会显着影响测得的沉积效率值：喷嘴的横向移动速度越高，则在所有其他情况下测得的沉积效率相同的情况越小。可以通过以下事实来解释这种行为：颗粒对基材的第一次冲击不会导致其粘附到表面上，因此不会导致涂层沉积。众所周知，在涂层开始生长之前，必须使基材表面经受足够数量的颗粒冲击。该准备阶段称为激活阶段，或沉积过程的延迟（诱导）阶段。首次显示在活化阶段消耗的粉末的比重（每单位面积）取决于加速气流的停滞温度：停滞温度越高，消耗的比重越低。