The porous expanded graphite (EG) was metallized by electroless plating to improve the C‒Cu interface bonding, and the copper-plated EG/Cu (EG@Cu/Cu) composites with different EG content (1–4 wt%) were fabricated by spark plasma sintering (SPS). The effects of EG content on the microstructure, physical properties, bending properties, and tribological properties of EG@Cu/Cu composites were studied in detail. The results show that the copper-plated composite powder inherits the worm structure of EG, and forms a dense copper coating with a thickness of 2–5 µm. During electroless plating, the plating solution penetrated into the EG particles and formed a microscopic 3D Cu network. Compared with the composite without copper plating, copper coating effectively improves the interface bonding of C‒Cu. EG@Cu/Cu composites retain the physical and mechanical properties of Cu matrix, and obtains lower friction coefficient and wear rate. The discrete and uniform distribution of EG improves the continuity of Cu matrix. When subjected to friction, the flexible EG could overflow from the surface within 10 min to form a saturated self-lubricating film. EG@Cu/Cu composite with 3 wt% EG has better comprehensive properties, the friction coefficient is 22.9% of pure copper, and the wear mass is 7.9% of pure copper. Abrasive wear is the main friction mechanism of EG@Cu/Cu composites.

通过化学镀处理对多孔膨胀石墨（EG）进行金属化处理，以改善C，Cu界面结合，并制造了具有不同EG含量（1-4 wt％）的镀铜EG / Cu（EG @ Cu / Cu）复合材料通过火花等离子体烧结（SPS）。详细研究了EG含量对EG @ Cu / Cu复合材料的微观结构，物理性能，弯曲性能和摩擦学性能的影响。结果表明，镀铜复合粉末继承了EG的蠕虫结构，并形成了2-5 µm的致密铜涂层。在化学镀期间，镀液渗入EG颗粒并形成微观3D Cu网络。与没有镀铜的复合材料相比，铜涂层有效地改善了C‒Cu的界面结合。EG @ Cu / Cu复合材料保留了Cu基体的物理和机械性能，并获得了较低的摩擦系数和磨损率。EG的离散和均匀分布提高了Cu基体的连续性。当受到摩擦时，柔性EG可能会在10分钟内从表面溢出，形成饱和的自润滑膜。EG @ 3％的EG @ Cu / Cu复合材料具有更好的综合性能，摩擦系数为纯铜的22.9％，磨损量为纯铜的7.9％。磨料磨损是EG @ Cu / Cu复合材料的主要摩擦机理。柔性EG可能会在10分钟内从表面溢出，形成饱和的自润滑膜。EG @ 3％的EG @ Cu / Cu复合材料具有更好的综合性能，摩擦系数为纯铜的22.9％，磨损量为纯铜的7.9％。磨料磨损是EG @ Cu / Cu复合材料的主要摩擦机理。柔性EG可能会在10分钟内从表面溢出，形成饱和的自润滑膜。EG含量为3％（重量）的EG @ Cu / Cu复合材料具有较好的综合性能，摩擦系数为纯铜的22.9％，磨损量为纯铜的7.9％。磨料磨损是EG @ Cu / Cu复合材料的主要摩擦机理。