In this paper, the tested chip was directly immersed in subcooled (ΔT_sub = 3 K) FC-72 for boiling heat transfer, and an experimental apparatus with suction tube was designed. A smooth silicon chip with the dimension of 10 × 10 × 0.5 mm³ (length × width × thickness) was used as a heater. The effects of inner diameter of suction tube (D = 2.2, 5.5 and 9.6 mm) and the distance from the suction tube inlet to the tested chip surface (H = 1, 3 and 5 mm) on boiling heat transfer performance were explored. For comparison, experiment without suction on a smooth surface was also conducted. The experimental results showed that the suction boiling has a significant heat transfer enhancement compared with the traditional pool boiling without suction. The suction tube with the diameter of 5.5 mm has the best boiling heat transfer performance, and then 9.6 mm followed by 2.2 mm under the same variables, and the suction distance of 1 mm shows the largest heat transfer enhancement. The heat transfer coefficient (HTC) increases with the decrease of the distance from the suction tube inlet to the tested heating surface. At D = 5.5 mm and H = 1 mm, the maximum critical heat flux (CHF) increased by 39.22% compared with pool boiling without suction, while the maximum CHF increased to 33.4 W·cm⁻², and the maximum HTC increased by 79.77% compared with pool boiling without suction, while the maximum HTC increased to 1.093W·cm⁻²·K⁻¹. The mechanism of the enhancement of the boiling heat transfer performance is attributed to that the liquid supplement is enhanced and the bubbles departure velocity is accelerated due to the local low pressure and shear lift force generated by the suction.

在本文中，被测试的芯片直接浸渍在过冷（ΔT_子 = 3 K）的FC-72沸腾传热，并与吸入管的实验装置的设计。使用尺寸为10×10×0.5 mm ³（长×宽×厚）的光滑硅芯片作为加热器。吸管内径（D  = 2.2、5.5和9.6 mm）以及吸管入口到被测切屑表面的距离（H的影响 分别对沸腾传热性能进行了研究（= 1，3和5 mm）为了比较，还进行了在光滑表面上没有抽吸的实验。实验结果表明，与传统的无抽吸池沸腾相比，抽吸沸腾具有显着的传热增强。直径为5.5 mm的吸管具有最佳的沸腾传热性能，在相同的变量下，吸热管的沸腾传热性能最佳，其次为9.6 mm，其次为2.2 mm，吸气距离为1 mm表示最大的传热增强。传热系数（HTC）随着从吸管入口到被测加热表面的距离的减小而增加。在D  = 5.5 mm和H处 = 1 mm时，与不进行抽吸的池沸腾相比，最大临界热通量（CHF）增加39.22％，而最大CHF升高至33.4 W·cm ^-2，并且最大HTC升高79.77％。 ，而最大HTC增加到1.093W·cm ^-2 ·K ^-1。沸腾传热性能提高的机理归因于：由于局部低压和由抽吸产生的剪切升力，液体补充剂增强，气泡离开速度加快。