We study the temperature effects on mobile charges in a thermopiezoelectric semiconductor plate through pyroelectric and thermoelastic couplings. The macroscopic theory of thermopiezoelectric semiconductors is used. A set of two-dimensional (2D) equations is derived for extension and bending with shear deformation of the plate. A few solutions are obtained. Numerical results show that the distribution of the mobile charges in the plate can be manipulated by the temperature field. In the case of temperature-induced uniform extension, a combination of physical parameters is identified which characterizes the strength of the coupling between the temperature field and the mobile charge distribution. The results obtained are fundamental to piezotronic devices involving temperature effects.

中文翻译：

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温度对热压电半导体板中移动电荷的影响

我们通过热电和热弹性耦合研究了温度对热压电半导体板中移动电荷的影响。使用热压电半导体的宏观理论。导出了一组二维 (2D) 方程，用于板的剪切变形的延伸和弯曲。获得了一些解决方案。数值结果表明，板中移动电荷的分布可以通过温度场来控制。在温度引起的均匀延伸的情况下，确定了表征温度场与移动电荷分布之间耦合强度的物理参数组合。所获得的结果对于涉及温度效应的压电器件来说是基础。