The silver (Ag) coated copper (Cu) paste were printed and sintered on silicon (Si) heterojunction solar cell via continuous intense pulsed light (IPL) as an electrode. The temperature of the electrode was monitored by thermocouple and infrared (IR) camera during IPL sintering process. To grasp more accurate temperature profile, a heat transfer simulation was also conducted by finite difference method. The line resistivity and contact resistivity of Ag coated Cu electrodes were evaluated with respect to light energy and the optimal IPL process parameter were chosen as light energy of 6 J/cm² and 5 cm/s conveyor belt speed. I-V curve of the Si solar cell was measured and there was only 0.2% reduction in efficiency compared to conventional Ag thermal cured electrodes. The efficiency was decreased slightly due to the decrease in the short circuit current (Jsc). It is noteworthy that the open circuit voltage (Voc) of the Si solar cell with IPL sintered Ag coated Cu paste, increased by 2 mV because the surface passivation was improved by light exposure. In addition, it was confirmed that there is no Cu diffusion problem by measuring the pseudo fill factor (pFF) for 6 months to secure the reliability of the solar cell.

印刷涂有银（Ag）的铜（Cu）浆料，并通过连续强脉冲光（IPL）作为电极在硅（Si）异质结太阳能电池上烧结。在IPL烧结过程中，通过热电偶和红外（IR）摄像机监控电极的温度。为了掌握更准确的温度曲线，还通过有限差分法进行了传热模拟。针对光能评估了涂银铜电极的线电阻率和接触电阻率，并选择了最佳IPL工艺参数作为6 J / cm ^2的光能和5 cm / s的传送带速度。测量了Si太阳能电池的IV曲线，与传统的Ag热固化电极相比，效率仅降低了0.2％。由于短路电流（Jsc）的降低，效率略有降低。值得注意的是，由于IPL烧结的Ag涂层的Cu糊料的Si太阳能电池的开路电压（Voc）增加了2 mV，这是因为通过光暴露可以改善表面钝化。另外，通过测量6个月的伪填充因子（pFF）来确认没有铜扩散问题，以确保太阳能电池的可靠性。