Rapidly solidified (RS) binary Sn–5 wt.% Sb and ternary Sn–5 wt.% Sb– x wt.% Ag, x = 1, 3 and 5 solder alloys were prepared in form of ribbons using melt spinning technique (MS). X-ray diffractometer (XRD), scanning electron microscopy (SEM) attached with energy dispersive x-ray technique (EDX) and differential scanning calorimetry (DSC) were used to investigate the impacts of Ag contents on microstructures and properties of the binary Sn–5 wt.% Sb rapidly solidified alloy. XRD analysis confirmed the formation of an ultrafine microstructure of Ag₃Sn intermetallic compound in addition to a supersaturated solid solution of Sn by Sb and Ag. Moreover, SEM and EDX analysis assigned the formation of SnSb intermetallic compound as well as the dissolution of Sb and Ag in β-Sn with maximum wt.% of 20.75 and 11.7 for Sn-5Sb and Sn-5Sb-5Ag ribbons, respectively. The melting point of the melt spun ribbons was lowered by 3.7 °C, 1.7 °C, 5.4 °C and 2.3 °C for the 0, 1, 3 and 5 Ag containing solder alloys as deduced by DSC. The rapidly solidified ribbons exhibit better Vickers hardness due to the microstructure refinements and the extension of solid solubilities of the alloying elements.

 使用熔融纺丝技术（MS）以带状形式制备快速凝固（RS）二元Sn–5 wt。％Sb和三元Sn–5 wt。％Sb– x wt。％Ag，x = 1、3和5焊料合金）。X射线衍射仪（XRD），结合能量色散X射线技术（EDX）的扫描电子显微镜（SEM）和差示扫描量热法（DSC）用于研究Ag含量对二元Sn– 5重量％的Sb快速凝固合金。XRD分析证实了Ag ₃的超细微结构的形成除Sb和Ag形成的Sn过饱和固溶体之外，还包括Sn金属间化合物。此外，SEM和EDX分析指定了Sn-5Sb和Sn-5Sb-5Ag带的SnSb金属间化合物的形成以及Sb和Ag在β -Sn中的溶解，最大wt。％分别为20.75和11.7。通过DSC推断，对于含0、1、3和5 Ag的焊料合金，熔纺带的熔点分别降低了3.7°C，1.7°C，5.4°C和2.3°C。快速凝固的薄带由于微结构的细化和合金元素的固溶度的扩展而表现出更好的维氏硬度。