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Decrease in Particles by Substituting Conductive Magnesium-Oxide Based Ceramics for Conventional Electrode Materials Used in Process Chamber of Plasma Etching
IEEE Transactions on Semiconductor Manufacturing ( IF 2.7 ) Pub Date : 2021-04-07 , DOI: 10.1109/tsm.2021.3071446
Yuji Kasashima , Takashi Ikeda , Tatsuo Tabaru

The corrosion of ceramic chamber parts causes particles in plasma etching process, so that the production yield and the overall equipment effectiveness (OEE) at LSI mass production line are decreased. We have developed magnesium oxide (MgO)-based ceramics whose corrosion resistance in reactive plasma is higher than conventional ceramic materials. In this study, we have prepared a shower-head-type electrode by using MgO-based ceramics, and demonstrated that the number of particles generated from the electrode is much lower than that generated from a conventional electrode made from aluminium oxide. The MgO-based ceramics contributes to improvement of the production yield and the OEE.

中文翻译:

用等离子蚀刻工艺腔室中的常规电极材料代替导电氧化镁基陶瓷来减少颗粒

陶瓷腔室部件的腐蚀会导致等离子体蚀刻过程中产生颗粒,从而降低了LSI大规模生产线的生产率和整体设备效率(OEE)。我们已经开发出基于氧化镁(MgO)的陶瓷,其在反应等离子体中的耐蚀性高于常规陶瓷材料。在这项研究中,我们通过使用基于MgO的陶瓷制备了喷头型电极,并证明了该电极产生的颗粒数量远低于常规氧化铝制成的电极。基于MgO的陶瓷有助于提高产量和OEE。
更新日期:2021-05-07
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