The effects of cold drawing process on the microstructure, mechanical properties and electrical conductivity of low-oxygen copper wires were studied. The results show that at low drawing strains (ε ≤ 1.23), the plastic deformation is dominated by planar slip, some of grains are rotated along the drawing direction, giving rise to a <111> texture. At medium strains (1.23 < ε ≤ 1.91), most of grains have re-oriented and laid parallel to the drawing direction, and the <111> and <100> textures are highly developed. At high strains (ε > 1.91), a fibrous structure is formed, with a staggered distribution of <111> and <100> textures. With the increase of drawing strain, the volume fraction of the <111> texture first increases and then decreases, while the volume fraction of the <100> texture increases monotonously. The yield strength first increases and then decreases, yielding the maximum value of 427.5 MPa at the strain of 1.91. Interestingly, the electrical conductivity of the copper wires changes with cold drawing strain and moves in the opposite way to the yield strength. The electrical conductivity first decreases and then increases with the minimum value at a strain of 1.91 (~87.5% IACS). At strains higher than 2.74, dynamic recrystallization occurs, resulting in a decrease in dislocation density and an increase in grain size. In addition to the dislocation density and grain size, the yield strength of the copper wires is further impacted by the texture development. The electrical conductivity is less influenced by dislocations and vacancies. Instead, it is dominated by those grain boundaries perpendicular to the drawing direction. An excellent strength-conductivity combination was achieved by tailoring the microstructure of copper wires. For example, a wire with the yield strength (YS) of 400.5 MPa and electrical conductivity (EC) of 94.3% IACS was acquired when the drawing strain reaches 2.74.

研究了冷拔工艺对低氧铜丝组织，力学性能和导电率的影响。结果表明，在低拉伸应变（ε≤1.23）下，塑性变形主要由平面滑移控制，一些晶粒沿拉伸方向旋转，从而产生<111>织构。在中等应变（1.23 <ε≤1.91）下，大多数晶粒已重新定向并平行于拉伸方向放置，并且<111>和<100>织构高度发达。在高应变（ε> 1.91）时，会形成纤维结构，其中<111>和<100>织构交错分布。随着拉伸应变的增加，<111>纹理的体积分数先增大然后减小，而<100>的体积分数 纹理单调增加。屈服强度首先增加然后减小，在1.91应变下产生最大值427.5 MPa。有趣的是，铜线的电导率随冷拔应变而变化，并以与屈服强度相反的方式移动。电导率首先降低，然后在1.91（〜87.5％IACS）的应变下以最小值增加。在高于2.74的应变下，会发生动态再结晶，从而导致位错密度降低和晶粒尺寸增大。除了位错密度和晶粒尺寸之外，铜丝的屈服强度还受织构发展的影响。电导率受位错和空位的影响较小。反而，它以垂直于拉伸方向的那些晶界为主。通过调整铜线的微观结构，可以实现出色的强度-导电性组合。例如，当拉伸应变达到2.74时，获得了屈服强度（YS）为400.5 MPa，电导率（EC）为94.3％IACS的电线。