Herein, a large-scale fabrication of radio frequency (RF) surface ion traps on a 300 mm glass wafer using a standard foundry process is reported. Established wafer-level packaging process of electroplated Cu with Au finish is used to fabricate the surface electrodes directly on the glass wafer substrate. A trap is tested by loading it with laser-cooled ⁸⁸Sr⁺ ions. The trap shows a stable operation with RF amplitudes in the range of 100–250 V at 33 MHz frequency. The ion lifetime is on the order of 30 min with laser cooling with a vacuum chamber pressure of ≈5 × 10⁻¹¹ mbar. These results demonstrate the potential of large-size foundry glass substrates to realize scalable and integratable trapped ion-based quantum devices.

中文翻译：

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在 300 毫米玻璃晶片上大规模制造表面离子阱

本文报道了使用标准铸造工艺在 300 毫米玻璃晶片上大规模制造射频 (RF) 表面离子阱。已建立的带有 Au 涂层的电镀铜的晶圆级封装工艺用于直接在玻璃晶圆基板上制造表面电极。通过用激光冷却的⁸⁸ Sr ⁺离子加载陷阱来测试陷阱。陷阱显示在 33 MHz 频率下 RF 幅度在 100–250 V 范围内的稳定运行。在真空室压力为≈5 × 10 ^-11 毫巴的激光冷却条件下，离子寿命约为 30 分钟。这些结果证明了大尺寸铸造玻璃基板在实现可扩展和可集成的基于俘获离子的量子器件方面的潜力。